CAE analysis of rapid thermal response molding process for thin wall parts

Keun Park; Byung Kim; Donggang Yao

CAE analysis of rapid thermal response molding process for thin wall parts

Keun Park, Byung Kim, Donggang Yao

Dept. of Mechanical System and Design Engineering

Research output: Contribution to conference › Paper › peer-review

1 Scopus citations

Abstract

The present work covers simulation of thin wall molding using the Rapid Thermal Response (RTR) molding process. In order to account for the unique thermal boundary conditions of the RTR mold, coupled analysis with heat transfer simulation is suggested. Both numerical and experimental results show good flow estimation and birefringence prediction under rapid mold heating.

Original language	English
Pages	1158-1162
Number of pages	5
State	Published - 2006
Event	Society of Plastics Engineers Annual Technical Conference 2006, ANTEC 2006 - Charlotte, NC, United States Duration: 7 May 2006 → 11 May 2006

Conference

Conference	Society of Plastics Engineers Annual Technical Conference 2006, ANTEC 2006
Country/Territory	United States
City	Charlotte, NC
Period	7/05/06 → 11/05/06

Keywords

Birefringence
CAE Analysis
Rapid Thermal Response Molding
Solid Element
Thin Wall Molding

Cite this

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title = "CAE analysis of rapid thermal response molding process for thin wall parts",

abstract = "The present work covers simulation of thin wall molding using the Rapid Thermal Response (RTR) molding process. In order to account for the unique thermal boundary conditions of the RTR mold, coupled analysis with heat transfer simulation is suggested. Both numerical and experimental results show good flow estimation and birefringence prediction under rapid mold heating.",

keywords = "Birefringence, CAE Analysis, Rapid Thermal Response Molding, Solid Element, Thin Wall Molding",

author = "Keun Park and Byung Kim and Donggang Yao",

year = "2006",

language = "English",

pages = "1158--1162",

note = "Society of Plastics Engineers Annual Technical Conference 2006, ANTEC 2006 ; Conference date: 07-05-2006 Through 11-05-2006",

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TY - CONF

T1 - CAE analysis of rapid thermal response molding process for thin wall parts

AU - Park, Keun

AU - Kim, Byung

AU - Yao, Donggang

PY - 2006

Y1 - 2006

N2 - The present work covers simulation of thin wall molding using the Rapid Thermal Response (RTR) molding process. In order to account for the unique thermal boundary conditions of the RTR mold, coupled analysis with heat transfer simulation is suggested. Both numerical and experimental results show good flow estimation and birefringence prediction under rapid mold heating.

AB - The present work covers simulation of thin wall molding using the Rapid Thermal Response (RTR) molding process. In order to account for the unique thermal boundary conditions of the RTR mold, coupled analysis with heat transfer simulation is suggested. Both numerical and experimental results show good flow estimation and birefringence prediction under rapid mold heating.

KW - Birefringence

KW - CAE Analysis

KW - Rapid Thermal Response Molding

KW - Solid Element

KW - Thin Wall Molding

UR - http://www.scopus.com/inward/record.url?scp=33745590721&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:33745590721

SP - 1158

EP - 1162

T2 - Society of Plastics Engineers Annual Technical Conference 2006, ANTEC 2006

Y2 - 7 May 2006 through 11 May 2006

ER -

CAE analysis of rapid thermal response molding process for thin wall parts

Abstract

Conference

Keywords

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