Abstract
Capillary-driven micro flow allows liquid transport by interfacial force without external pressure or momentum. Theoretical and ex-perimental studies have been conducted to predict the movement of the flow meniscus in the application of capillary underfill flows. In a flip chip package, two-dimensional motions of flow front through solder bumps can result in unwanted air void formation because the meniscus and the arrangement of the solid surface affect the interface dynamics. This study introduces analytical models of filling time and discusses their verification and limitations. Recent developments in underfill flow visualization are also presented to analyze flow phenomena, including the racing effect and void formation.
| Original language | English |
|---|---|
| Pages (from-to) | 3751-3759 |
| Number of pages | 9 |
| Journal | Journal of Mechanical Science and Technology |
| Volume | 26 |
| Issue number | 12 |
| DOIs | |
| State | Published - Dec 2012 |
Keywords
- Capillary underfill flow
- Filling time model
- Flip chip package
- Flow visualization
- Void formation