Characteristics of NEMS piezoresistive silicon nanowires pressure sensors with various diaphragm layers

  • Liang Lou
  • , Songsong Zhang
  • , Lishiah Lim
  • , Woo Tae Park
  • , Hanhua Feng
  • , Dim Lee Kwong
  • , Chengkuo Lee

Research output: Contribution to journalConference articlepeer-review

10 Scopus citations

Abstract

Optimized diaphragm structures comprising silicon nitride (SiNx) film integrated with piezoresistive silicon nanowires (SiNW) are characterized for nanoelectromechanical system (NEMS) pressure sensors. Several improvements are done in comparison with our previously reported device [1]. Firstly, p-type SiNWs of 1 μm with 1E14 implantation instead of 10 μm 1E13 implantation are adopted to gain more uniform stress and show better linearity. Secondly, by using SiO 2+SiNx bi-layer film instead of pure SiO 2 film, the membrane is not only flat, but also toughened to be able to withstand pressure up to 40 atm. Finally, the real test shows that the sensitivity of pressure sensor is doubled by thinning down the SiNx film to half thickness.

Original languageEnglish
Pages (from-to)1433-1436
Number of pages4
JournalProcedia Engineering
Volume25
DOIs
StatePublished - 2011
Event25th Eurosensors Conference - Athens, Greece
Duration: 4 Sep 20117 Sep 2011

Keywords

  • Diaphragm
  • Nano-electro-mechanical systems (NEMS)
  • Piezoresistive silicon nanowire
  • Pressure sensor
  • Thin film

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