TY - JOUR
T1 - Characteristics of NEMS piezoresistive silicon nanowires pressure sensors with various diaphragm layers
AU - Lou, Liang
AU - Zhang, Songsong
AU - Lim, Lishiah
AU - Park, Woo Tae
AU - Feng, Hanhua
AU - Kwong, Dim Lee
AU - Lee, Chengkuo
PY - 2011
Y1 - 2011
N2 - Optimized diaphragm structures comprising silicon nitride (SiNx) film integrated with piezoresistive silicon nanowires (SiNW) are characterized for nanoelectromechanical system (NEMS) pressure sensors. Several improvements are done in comparison with our previously reported device [1]. Firstly, p-type SiNWs of 1 μm with 1E14 implantation instead of 10 μm 1E13 implantation are adopted to gain more uniform stress and show better linearity. Secondly, by using SiO 2+SiNx bi-layer film instead of pure SiO 2 film, the membrane is not only flat, but also toughened to be able to withstand pressure up to 40 atm. Finally, the real test shows that the sensitivity of pressure sensor is doubled by thinning down the SiNx film to half thickness.
AB - Optimized diaphragm structures comprising silicon nitride (SiNx) film integrated with piezoresistive silicon nanowires (SiNW) are characterized for nanoelectromechanical system (NEMS) pressure sensors. Several improvements are done in comparison with our previously reported device [1]. Firstly, p-type SiNWs of 1 μm with 1E14 implantation instead of 10 μm 1E13 implantation are adopted to gain more uniform stress and show better linearity. Secondly, by using SiO 2+SiNx bi-layer film instead of pure SiO 2 film, the membrane is not only flat, but also toughened to be able to withstand pressure up to 40 atm. Finally, the real test shows that the sensitivity of pressure sensor is doubled by thinning down the SiNx film to half thickness.
KW - Diaphragm
KW - Nano-electro-mechanical systems (NEMS)
KW - Piezoresistive silicon nanowire
KW - Pressure sensor
KW - Thin film
UR - https://www.scopus.com/pages/publications/84863155012
U2 - 10.1016/j.proeng.2011.12.354
DO - 10.1016/j.proeng.2011.12.354
M3 - Conference article
AN - SCOPUS:84863155012
SN - 1877-7058
VL - 25
SP - 1433
EP - 1436
JO - Procedia Engineering
JF - Procedia Engineering
T2 - 25th Eurosensors Conference
Y2 - 4 September 2011 through 7 September 2011
ER -