TY - GEN
T1 - Characterization and Optimization of SiCN Films for Low-Temperature Cu Hybrid Bonding
AU - Kim, Yeonju
AU - Park, Jongkyung
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - As Moore's Law approaches its physical limits, this study explores SiCN's potential as a superior alternative to SiO2 for low-temperature hybrid bonding in 3D integration. We analyze SiCN films deposited at 180°C and 350°C to achieve defect-free interfaces comparable to those in higher-temperature processes. This helps reduce the thermal budget and prevent device degradation. Additionally, we employ O2 plasma treatments to lower the bonding temperature to 180°C further. The research ultimately aims to establish SiCN-SiCN low-temperature hybrid bonding as a viable and effective solution for next-generation semiconductor applications.
AB - As Moore's Law approaches its physical limits, this study explores SiCN's potential as a superior alternative to SiO2 for low-temperature hybrid bonding in 3D integration. We analyze SiCN films deposited at 180°C and 350°C to achieve defect-free interfaces comparable to those in higher-temperature processes. This helps reduce the thermal budget and prevent device degradation. Additionally, we employ O2 plasma treatments to lower the bonding temperature to 180°C further. The research ultimately aims to establish SiCN-SiCN low-temperature hybrid bonding as a viable and effective solution for next-generation semiconductor applications.
UR - https://www.scopus.com/pages/publications/85216933425
U2 - 10.1109/IMPACT63555.2024.10818886
DO - 10.1109/IMPACT63555.2024.10818886
M3 - Conference contribution
AN - SCOPUS:85216933425
T3 - Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
SP - 374
EP - 377
BT - Proceedings - 19th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2024
PB - IEEE Computer Society
T2 - 19th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2024
Y2 - 22 October 2024 through 25 October 2024
ER -