Characterization of novel high-speed die attachment method at 225 °C using submicrometer Ag-coated Cu particles

Chang Hyun Lee, Eun Byeol Choi, Jong Hyun Lee

Research output: Contribution to journalArticlepeer-review

49 Scopus citations

Abstract

A novel die-attaching technology, using the in-situ dewetting of Ag shells in submicrometer Ag-coated Cu (Cu@Ag) particles during heating in air, was suggested for power device packaging. The particle size-dependent dewetting of Ag induced the formation of tiny nodules and rapid sinter bonding via fast Ag transfer under external pressure. A die attached by thermal compression for 5 min at 225 °C using 200- or 350-nm Cu@Ag particles showed shear strengths approaching or surpassing that (18.0 MPa) of a die attached using Pb-5Sb.

Original languageEnglish
Pages (from-to)7-12
Number of pages6
JournalScripta Materialia
Volume150
DOIs
StatePublished - Jun 2018

Keywords

  • Bonding by silver dewetting
  • Electronic packaging
  • Nanostructured materials
  • Sintering
  • Surface modification

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