Abstract
A novel die-attaching technology, using the in-situ dewetting of Ag shells in submicrometer Ag-coated Cu (Cu@Ag) particles during heating in air, was suggested for power device packaging. The particle size-dependent dewetting of Ag induced the formation of tiny nodules and rapid sinter bonding via fast Ag transfer under external pressure. A die attached by thermal compression for 5 min at 225 °C using 200- or 350-nm Cu@Ag particles showed shear strengths approaching or surpassing that (18.0 MPa) of a die attached using Pb-5Sb.
Original language | English |
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Pages (from-to) | 7-12 |
Number of pages | 6 |
Journal | Scripta Materialia |
Volume | 150 |
DOIs | |
State | Published - Jun 2018 |
Keywords
- Bonding by silver dewetting
- Electronic packaging
- Nanostructured materials
- Sintering
- Surface modification