TY - JOUR
T1 - Characterization of reflow soldering at a peak temperature of 215 °C using a Bi-coated Sn-3.0Ag-0.5Cu solder ball
AU - Hwang, Jun Ho
AU - Lee, Jong Hyun
N1 - Publisher Copyright:
© 2018 Elsevier B.V.
PY - 2018/10/1
Y1 - 2018/10/1
N2 - Reflow soldering using a Bi-coated Sn-3.0(wt%)Ag-0.5Cu (SAC305) solder ball was successfully performed at a low peak temperature of 215 °C. The Bi shell promptly transformed into a Sn-58Bi eutectic alloy by rapid Bi diffusion into the inner SAC305 during heating, which resulted in melting at 138 °C. The bonding area on a Cu pad produced by melting increased proportionally with the initial thickness of the Bi shell. Although the overall shear force of the solder bump was lower than those of Sn-58Bi and SAC305 bumps due to the smaller bonding area, the shear force per unit area was the highest.
AB - Reflow soldering using a Bi-coated Sn-3.0(wt%)Ag-0.5Cu (SAC305) solder ball was successfully performed at a low peak temperature of 215 °C. The Bi shell promptly transformed into a Sn-58Bi eutectic alloy by rapid Bi diffusion into the inner SAC305 during heating, which resulted in melting at 138 °C. The bonding area on a Cu pad produced by melting increased proportionally with the initial thickness of the Bi shell. Although the overall shear force of the solder bump was lower than those of Sn-58Bi and SAC305 bumps due to the smaller bonding area, the shear force per unit area was the highest.
KW - Bi-coated solder ball
KW - Bi-coating thickness
KW - Low-temperature reflow soldering
KW - Shear strength
KW - Strain-rate sensitivity
UR - https://www.scopus.com/pages/publications/85047441072
U2 - 10.1016/j.apsusc.2018.05.129
DO - 10.1016/j.apsusc.2018.05.129
M3 - Article
AN - SCOPUS:85047441072
SN - 0169-4332
VL - 454
SP - 227
EP - 232
JO - Applied Surface Science
JF - Applied Surface Science
ER -