Conductive paste based interconnection for photovoltaic modules

Hyung Jun Song; Woo Gyun Shin; Heesang Yoon; Hye Mi Hwang; Young Chul Ju; Suk Whan Ko; Min Gu Kang; Jeong In Lee; Hee Eun Song; Gi Hwan Kang

doi:10.1109/PVSC.2018.8547639

Conductive paste based interconnection for photovoltaic modules

Hyung Jun Song, Woo Gyun Shin, Heesang Yoon, Hye Mi Hwang, Young Chul Ju, Suk Whan Ko, Min Gu Kang, Jeong In Lee, Hee Eun Song, Gi Hwan Kang

Dept. of Safety Engineering

Korea Institute of Energy Research

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Scopus citations

Abstract

We proposed low-temperature interconnection method using conductive paste (CP) for photovoltaic modules with thin c-Si cells. The advantage of CP approach is significantly reduced thermo-mechanical stress, as a result of the low tabbing process temperature (< 150 °C). The resistivity loss induced by CP based approach is in the same range of module integrated by high temperature tip contacted soldering. Furthermore, thermal cycle and mechanical load tests confirm that CP provides stable interconnection between cell and module (degraded only 0.6%). Hence, unique traits of CP approach indicate that CP soldering is a production-ready alternative for interconnecting thin cells.

Original language	English
Title of host publication	2018 IEEE 7th World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - A Joint Conference of 45th IEEE PVSC, 28th PVSEC and 34th EU PVSEC
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	2838-2840
Number of pages	3
ISBN (Electronic)	9781538685297
DOIs	https://doi.org/10.1109/PVSC.2018.8547639
State	Published - 26 Nov 2018
Event	7th IEEE World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - Waikoloa Village, United States Duration: 10 Jun 2018 → 15 Jun 2018

Publication series

Name	2018 IEEE 7th World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - A Joint Conference of 45th IEEE PVSC, 28th PVSEC and 34th EU PVSEC

Conference

Conference	7th IEEE World Conference on Photovoltaic Energy Conversion, WCPEC 2018
Country/Territory	United States
City	Waikoloa Village
Period	10/06/18 → 15/06/18

Keywords

conductive paste
interconnection
silicon photovoltaic module
thermal stress
thin cells

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

Access to Document

10.1109/PVSC.2018.8547639

Cite this

Song, H. J., Shin, W. G., Yoon, H., Hwang, H. M., Ju, Y. C., Ko, S. W., Kang, M. G., Lee, J. I., Song, H. E., & Kang, G. H. (2018). Conductive paste based interconnection for photovoltaic modules. In 2018 IEEE 7th World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - A Joint Conference of 45th IEEE PVSC, 28th PVSEC and 34th EU PVSEC (pp. 2838-2840). Article 8547639 (2018 IEEE 7th World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - A Joint Conference of 45th IEEE PVSC, 28th PVSEC and 34th EU PVSEC). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/PVSC.2018.8547639

Song, Hyung Jun ; Shin, Woo Gyun ; Yoon, Heesang et al. / Conductive paste based interconnection for photovoltaic modules. 2018 IEEE 7th World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - A Joint Conference of 45th IEEE PVSC, 28th PVSEC and 34th EU PVSEC. Institute of Electrical and Electronics Engineers Inc., 2018. pp. 2838-2840 (2018 IEEE 7th World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - A Joint Conference of 45th IEEE PVSC, 28th PVSEC and 34th EU PVSEC).

@inproceedings{9fd8123d23b34f6f8e9bf963cfe2f185,

title = "Conductive paste based interconnection for photovoltaic modules",

abstract = "We proposed low-temperature interconnection method using conductive paste (CP) for photovoltaic modules with thin c-Si cells. The advantage of CP approach is significantly reduced thermo-mechanical stress, as a result of the low tabbing process temperature (< 150 °C). The resistivity loss induced by CP based approach is in the same range of module integrated by high temperature tip contacted soldering. Furthermore, thermal cycle and mechanical load tests confirm that CP provides stable interconnection between cell and module (degraded only 0.6%). Hence, unique traits of CP approach indicate that CP soldering is a production-ready alternative for interconnecting thin cells.",

keywords = "conductive paste, interconnection, silicon photovoltaic module, thermal stress, thin cells",

author = "Song, {Hyung Jun} and Shin, {Woo Gyun} and Heesang Yoon and Hwang, {Hye Mi} and Ju, {Young Chul} and Ko, {Suk Whan} and Kang, {Min Gu} and Lee, {Jeong In} and Song, {Hee Eun} and Kang, {Gi Hwan}",

note = "Publisher Copyright: {\textcopyright} 2018 IEEE.; 7th IEEE World Conference on Photovoltaic Energy Conversion, WCPEC 2018 ; Conference date: 10-06-2018 Through 15-06-2018",

year = "2018",

month = nov,

day = "26",

doi = "10.1109/PVSC.2018.8547639",

language = "English",

series = "2018 IEEE 7th World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - A Joint Conference of 45th IEEE PVSC, 28th PVSEC and 34th EU PVSEC",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "2838--2840",

booktitle = "2018 IEEE 7th World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - A Joint Conference of 45th IEEE PVSC, 28th PVSEC and 34th EU PVSEC",

}

Song, HJ, Shin, WG, Yoon, H, Hwang, HM, Ju, YC, Ko, SW, Kang, MG, Lee, JI, Song, HE & Kang, GH 2018, Conductive paste based interconnection for photovoltaic modules. in 2018 IEEE 7th World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - A Joint Conference of 45th IEEE PVSC, 28th PVSEC and 34th EU PVSEC., 8547639, 2018 IEEE 7th World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - A Joint Conference of 45th IEEE PVSC, 28th PVSEC and 34th EU PVSEC, Institute of Electrical and Electronics Engineers Inc., pp. 2838-2840, 7th IEEE World Conference on Photovoltaic Energy Conversion, WCPEC 2018, Waikoloa Village, United States, 10/06/18. https://doi.org/10.1109/PVSC.2018.8547639

Conductive paste based interconnection for photovoltaic modules. / Song, Hyung Jun; Shin, Woo Gyun; Yoon, Heesang et al.
2018 IEEE 7th World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - A Joint Conference of 45th IEEE PVSC, 28th PVSEC and 34th EU PVSEC. Institute of Electrical and Electronics Engineers Inc., 2018. p. 2838-2840 8547639 (2018 IEEE 7th World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - A Joint Conference of 45th IEEE PVSC, 28th PVSEC and 34th EU PVSEC).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Conductive paste based interconnection for photovoltaic modules

AU - Song, Hyung Jun

AU - Shin, Woo Gyun

AU - Yoon, Heesang

AU - Hwang, Hye Mi

AU - Ju, Young Chul

AU - Ko, Suk Whan

AU - Kang, Min Gu

AU - Lee, Jeong In

AU - Song, Hee Eun

AU - Kang, Gi Hwan

PY - 2018/11/26

Y1 - 2018/11/26

N2 - We proposed low-temperature interconnection method using conductive paste (CP) for photovoltaic modules with thin c-Si cells. The advantage of CP approach is significantly reduced thermo-mechanical stress, as a result of the low tabbing process temperature (< 150 °C). The resistivity loss induced by CP based approach is in the same range of module integrated by high temperature tip contacted soldering. Furthermore, thermal cycle and mechanical load tests confirm that CP provides stable interconnection between cell and module (degraded only 0.6%). Hence, unique traits of CP approach indicate that CP soldering is a production-ready alternative for interconnecting thin cells.

AB - We proposed low-temperature interconnection method using conductive paste (CP) for photovoltaic modules with thin c-Si cells. The advantage of CP approach is significantly reduced thermo-mechanical stress, as a result of the low tabbing process temperature (< 150 °C). The resistivity loss induced by CP based approach is in the same range of module integrated by high temperature tip contacted soldering. Furthermore, thermal cycle and mechanical load tests confirm that CP provides stable interconnection between cell and module (degraded only 0.6%). Hence, unique traits of CP approach indicate that CP soldering is a production-ready alternative for interconnecting thin cells.

KW - conductive paste

KW - interconnection

KW - silicon photovoltaic module

KW - thermal stress

KW - thin cells

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U2 - 10.1109/PVSC.2018.8547639

DO - 10.1109/PVSC.2018.8547639

M3 - Conference contribution

AN - SCOPUS:85059900200

T3 - 2018 IEEE 7th World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - A Joint Conference of 45th IEEE PVSC, 28th PVSEC and 34th EU PVSEC

SP - 2838

EP - 2840

BT - 2018 IEEE 7th World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - A Joint Conference of 45th IEEE PVSC, 28th PVSEC and 34th EU PVSEC

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 7th IEEE World Conference on Photovoltaic Energy Conversion, WCPEC 2018

Y2 - 10 June 2018 through 15 June 2018

ER -

Song HJ, Shin WG, Yoon H, Hwang HM, Ju YC, Ko SW et al. Conductive paste based interconnection for photovoltaic modules. In 2018 IEEE 7th World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - A Joint Conference of 45th IEEE PVSC, 28th PVSEC and 34th EU PVSEC. Institute of Electrical and Electronics Engineers Inc. 2018. p. 2838-2840. 8547639. (2018 IEEE 7th World Conference on Photovoltaic Energy Conversion, WCPEC 2018 - A Joint Conference of 45th IEEE PVSC, 28th PVSEC and 34th EU PVSEC). doi: 10.1109/PVSC.2018.8547639

Conductive paste based interconnection for photovoltaic modules

Abstract

Publication series

Conference

Keywords

UN SDGs

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