TY - GEN
T1 - Crosstalk-Free Mesh-Embedded Tactile Sensor Array with Electrically Isolated Sensing Cells
AU - Bae, Kyubin
AU - Pyo, Soonjae
AU - Kim, Jongbaeg
N1 - Publisher Copyright:
© 2020 IEEE.
PY - 2020/1
Y1 - 2020/1
N2 - This paper reports a crosstalk-free, highly-durable piezo-resistive tactile sensor array based on carbon nanotube (CNT) and polydimethylsiloxane (PDMS) composite formed in fiberglass mesh. The composite in the mesh fabricated by simple solution process is utilized as a sensing material. The mesh structure electrically isolates each sensing element, preventing crosstalk between adjacent cells, while it mechanically connects all of them as a single sensing sheet. When pressure is applied to the sensor, the cells under pressure are deformed, and their electrical resistance decreases. The mesh-embedded sensor exhibited high sensitivity in a wide pressure range. We also demonstrated pressure mapping without noticeable crosstalk.
AB - This paper reports a crosstalk-free, highly-durable piezo-resistive tactile sensor array based on carbon nanotube (CNT) and polydimethylsiloxane (PDMS) composite formed in fiberglass mesh. The composite in the mesh fabricated by simple solution process is utilized as a sensing material. The mesh structure electrically isolates each sensing element, preventing crosstalk between adjacent cells, while it mechanically connects all of them as a single sensing sheet. When pressure is applied to the sensor, the cells under pressure are deformed, and their electrical resistance decreases. The mesh-embedded sensor exhibited high sensitivity in a wide pressure range. We also demonstrated pressure mapping without noticeable crosstalk.
KW - crosstalk-free pressure distribution
KW - mesh-embedded structure
KW - polydimethylsiloxane
KW - Tactile sensor array
UR - https://www.scopus.com/pages/publications/85083199196
U2 - 10.1109/MEMS46641.2020.9056345
DO - 10.1109/MEMS46641.2020.9056345
M3 - Conference contribution
AN - SCOPUS:85083199196
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 673
EP - 676
BT - 33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020
Y2 - 18 January 2020 through 22 January 2020
ER -