@inproceedings{6683c37b50764bfdacae071d16446fb4,
title = "Deformation behavior of MEMS package subjected to temperature change using moir{\'e} interferometry",
abstract = "In MEMS devices, stresses induced by the mismatch in thermal expansion among the materials composed of the package cause uneven deformation of MEMS structure, resulting in frequency change or breakage of the structure. In this paper, deformation behavior of MEMS gyroscope package subjected to temperature change is investigated using high-sensitivity moir{\'e} interferometry. Using the real-time moir{\'e} setup, fringe patterns are recorded and analyzed at several temperatures. Temperature dependent analyses of warpages and extensions/contractions of the package are presented. Linear elastic behavior is documented in the temperature region of room temperature to 125°C. Analysis of the package reveals that global bending occurs due to the mismatch of thermal expansion coefficient between the chip, the molding compound and the PCB. Global and local deformations of the package by the temperature change are investigated in detail to focus on the variation of natural frequency of MEMS gyro chip.",
author = "Joo, \{Jin Won\} and Kim, \{Yong Yun\} and Choa, \{Sung Hoon\} and Kim, \{Jong Suk\} and Jeong, \{Byung Gil\}",
year = "2005",
language = "English",
isbn = "0912053909",
series = "Proceedings of the 2005 SEM Annual Conference and Exposition on Experimental and Applied Mechanics",
pages = "1895--1901",
booktitle = "Proceedings of the 2005 SEM Annual Conference and Exposition on Experimental and Applied Mechanics",
note = "2005 SEM Annual Conference and Exposition on Experimental and Applied Mechanics ; Conference date: 07-06-2005 Through 09-06-2005",
}