Deposition of pure Cu films on glass substrates by decomposition of Cu complex pastes at 250 °C and additional Cu plating

Chang Hyun Lee; Chang Yong Hyun; Jong Hyun Lee

doi:10.1016/j.apsusc.2018.12.141

Deposition of pure Cu films on glass substrates by decomposition of Cu complex pastes at 250 °C and additional Cu plating

Chang Hyun Lee
, Chang Yong Hyun
, Jong Hyun Lee

Dept. of Materials Science & Engineering

Seoul National University of Science and Technology (SNUST)

Research output: Contribution to journal › Article › peer-review

13 Scopus citations

Abstract

Pure Cu film strongly adherent to glass substrates was deposited by printing Cu(COOH)₂-containing paste and decomposing it at 250 °C in nitrogen atmosphere. The complete transformation of Cu(COOH)₂ into Cu required 30 min and generated a low sheet resistance of 0.167 Ω/sq (volume resistivity: 15.0 μΩ·cm). Maximum adhesion between the Cu film and substrate was attained at the Cu complexes:α-terpineol mixing ratio of 6:4 by weight. The spike-shaped microstructure at the Cu/glass interface was determined to be the main cause for the outstanding adhesion properties. The resistance further decreased to 0.084 Ω/sq by increasing the thickness and modifying the surface of the Cu film via electroless Cu plating.

Original language	English
Pages (from-to)	359-365
Number of pages	7
Journal	Applied Surface Science
Volume	473
DOIs	https://doi.org/10.1016/j.apsusc.2018.12.141
State	Published - 15 Apr 2019

Keywords

Adhesion
Cu complex paste
Cu film
Decomposition
Glass substrate

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10.1016/j.apsusc.2018.12.141

Cite this

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title = "Deposition of pure Cu films on glass substrates by decomposition of Cu complex pastes at 250 °C and additional Cu plating",

abstract = "Pure Cu film strongly adherent to glass substrates was deposited by printing Cu(COOH)2-containing paste and decomposing it at 250 °C in nitrogen atmosphere. The complete transformation of Cu(COOH)2 into Cu required 30 min and generated a low sheet resistance of 0.167 Ω/sq (volume resistivity: 15.0 μΩ·cm). Maximum adhesion between the Cu film and substrate was attained at the Cu complexes:α-terpineol mixing ratio of 6:4 by weight. The spike-shaped microstructure at the Cu/glass interface was determined to be the main cause for the outstanding adhesion properties. The resistance further decreased to 0.084 Ω/sq by increasing the thickness and modifying the surface of the Cu film via electroless Cu plating.",

keywords = "Adhesion, Cu complex paste, Cu film, Decomposition, Glass substrate",

author = "Lee, \{Chang Hyun\} and Hyun, \{Chang Yong\} and Lee, \{Jong Hyun\}",

note = "Publisher Copyright: {\textcopyright} 2018 Elsevier B.V.",

year = "2019",

month = apr,

day = "15",

doi = "10.1016/j.apsusc.2018.12.141",

language = "English",

volume = "473",

pages = "359--365",

journal = "Applied Surface Science",

issn = "0169-4332",

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TY - JOUR

T1 - Deposition of pure Cu films on glass substrates by decomposition of Cu complex pastes at 250 °C and additional Cu plating

AU - Lee, Chang Hyun

AU - Hyun, Chang Yong

AU - Lee, Jong Hyun

PY - 2019/4/15

Y1 - 2019/4/15

N2 - Pure Cu film strongly adherent to glass substrates was deposited by printing Cu(COOH)2-containing paste and decomposing it at 250 °C in nitrogen atmosphere. The complete transformation of Cu(COOH)2 into Cu required 30 min and generated a low sheet resistance of 0.167 Ω/sq (volume resistivity: 15.0 μΩ·cm). Maximum adhesion between the Cu film and substrate was attained at the Cu complexes:α-terpineol mixing ratio of 6:4 by weight. The spike-shaped microstructure at the Cu/glass interface was determined to be the main cause for the outstanding adhesion properties. The resistance further decreased to 0.084 Ω/sq by increasing the thickness and modifying the surface of the Cu film via electroless Cu plating.

AB - Pure Cu film strongly adherent to glass substrates was deposited by printing Cu(COOH)2-containing paste and decomposing it at 250 °C in nitrogen atmosphere. The complete transformation of Cu(COOH)2 into Cu required 30 min and generated a low sheet resistance of 0.167 Ω/sq (volume resistivity: 15.0 μΩ·cm). Maximum adhesion between the Cu film and substrate was attained at the Cu complexes:α-terpineol mixing ratio of 6:4 by weight. The spike-shaped microstructure at the Cu/glass interface was determined to be the main cause for the outstanding adhesion properties. The resistance further decreased to 0.084 Ω/sq by increasing the thickness and modifying the surface of the Cu film via electroless Cu plating.

KW - Adhesion

KW - Cu complex paste

KW - Cu film

KW - Decomposition

KW - Glass substrate

UR - https://www.scopus.com/pages/publications/85058680138

U2 - 10.1016/j.apsusc.2018.12.141

DO - 10.1016/j.apsusc.2018.12.141

M3 - Article

AN - SCOPUS:85058680138

SN - 0169-4332

VL - 473

SP - 359

EP - 365

JO - Applied Surface Science

JF - Applied Surface Science

ER -

Deposition of pure Cu films on glass substrates by decomposition of Cu complex pastes at 250 °C and additional Cu plating

Abstract

Keywords

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Deposition of pure Cu films on glass substrates by decomposition of Cu complex pastes at 250 °C and additional Cu plating

Abstract

Keywords

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Cite this

Deposition of pure Cu films on glass substrates by decomposition of Cu complex pastes at 250 °C and additional Cu plating