DESIGN AND CONTROL OF A WAFER HANDLING MODULE FOR HYBRID BONDING

Dahoon Ahn, Hak Jun Lee

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Original languageEnglish
Title of host publicationProceedings - ASPE 2022 Annual Meeting
PublisherAmerican Society for Precision Engineering, ASPE
Pages329-332
Number of pages4
ISBN (Electronic)9781887706568
StatePublished - 2022
Event37th Annual Meeting of the American Society for Precision Engineering, ASPE 2022 - Bellevue, United States
Duration: 10 Oct 202214 Oct 2022

Publication series

NameProceedings - ASPE 2022 Annual Meeting

Conference

Conference37th Annual Meeting of the American Society for Precision Engineering, ASPE 2022
Country/TerritoryUnited States
CityBellevue
Period10/10/2214/10/22

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