TY - GEN
T1 - Design of Static-Current-Free PAM-3 Transmitter for TSV I/O Interfaces
AU - Kang, Sun Young
AU - Lee, Won Young
N1 - Publisher Copyright:
© 2025 IEEE.
PY - 2025
Y1 - 2025
N2 - This paper proposes a PAM-3 driver and its corresponding encoder architecture for TSV I/O interfaces in High-Bandwidth Memory (HBM). To address the increasing demand for high-speed data transfer with reduced power consumption, a static-current-free output driver is designed for the unterminated structure of TSV I/Os, thereby improving energy efficiency. The encoder is optimized to minimize logic complexity. The proposed transmitter operates at 24Gb/s, achieving an energy efficiency of 0.053pJ/bit. By eliminating static current paths in main driver, the main driver consumes only 0.59mW using a 0.6V supply. The overall circuit is implemented in 65nm CMOS technology.
AB - This paper proposes a PAM-3 driver and its corresponding encoder architecture for TSV I/O interfaces in High-Bandwidth Memory (HBM). To address the increasing demand for high-speed data transfer with reduced power consumption, a static-current-free output driver is designed for the unterminated structure of TSV I/Os, thereby improving energy efficiency. The encoder is optimized to minimize logic complexity. The proposed transmitter operates at 24Gb/s, achieving an energy efficiency of 0.053pJ/bit. By eliminating static current paths in main driver, the main driver consumes only 0.59mW using a 0.6V supply. The overall circuit is implemented in 65nm CMOS technology.
KW - HBM(High-Bandwidth Memory)
KW - PAM(Pulse Amplitude Modulation)
KW - Static current
KW - TSV(Through-Silicon Via)
UR - https://www.scopus.com/pages/publications/105033151595
U2 - 10.1109/ISOCC66390.2025.11329718
DO - 10.1109/ISOCC66390.2025.11329718
M3 - Conference contribution
AN - SCOPUS:105033151595
T3 - International SoC Design Conference 2025, ISOCC 2025 - Proceedings of Technical Papers
BT - International SoC Design Conference 2025, ISOCC 2025 - Proceedings of Technical Papers
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 22nd International SoC Design Conference, ISOCC 2025
Y2 - 15 October 2025 through 18 October 2025
ER -