@inproceedings{543c7153fe7e4979a35488cb7a488a94,
title = "Development of high-performance band pass filter in the V-frequency band using multilayer MCM-D technology",
abstract = "Novel system-on-package (SOP) - D technology to improve the mechanical and thermal properties of a MCM-D substrate was suggested. Based on this investigation, the band pass filter for the V-band application with unique circuit and structure was designed and implemented using 2-metals, 3-BCB layers. In the mean while the effective electrical conductivity of metal layer was extracted and its value was 4×107 S/m. The insertion loss of band pass filter at 55 GHz was 2.6 dB and group delay was below 0.06 ns. In filter structure, loading capacitor operates as a frequency controller without distortion of inband performance. Suggested MCM-D substrate with band pass filter can be used to evaluate mm-Wave system including flip-chip bonded MMIC. In final manuscript, the electrical characteristics of BCB layer upto mm-Wave region using ring, T resonator method will be included.",
keywords = "Band pass filter, SOP-D, V-band",
author = "Yoo, \{Chan Sei\} and Song, \{Sang Sub\} and Kim, \{Dong Hwan\} and Lee, \{Woo Sung\} and Kang, \{Nam Kee\} and Park, \{Jong Chul\} and Seo, \{Kwang K.\}",
year = "2006",
doi = "10.1109/EUMC.2006.281213",
language = "English",
isbn = "2960055160",
series = "Proceedings of the 36th European Microwave Conference, EuMC 2006",
publisher = "IEEE Computer Society",
pages = "114--117",
booktitle = "Proceedings of the 36th European Microwave Conference, EuMC 2006",
note = "36th European Microwave Conference, EuMC 2006 ; Conference date: 10-09-2006 Through 12-09-2006",
}