Development of high-performance band pass filter in the V-frequency band using multilayer MCM-D technology

Chan Sei Yoo, Sang Sub Song, Dong Hwan Kim, Woo Sung Lee, Nam Kee Kang, Jong Chul Park, Kwang K. Seo

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

Novel system-on-package (SOP) - D technology to improve the mechanical and thermal properties of a MCM-D substrate was suggested. Based on this investigation, the band pass filter for the V-band application with unique circuit and structure was designed and implemented using 2-metals, 3-BCB layers. In the mean while the effective electrical conductivity of metal layer was extracted and its value was 4×107 S/m. The insertion loss of band pass filter at 55 GHz was 2.6 dB and group delay was below 0.06 ns. In filter structure, loading capacitor operates as a frequency controller without distortion of inband performance. Suggested MCM-D substrate with band pass filter can be used to evaluate mm-Wave system including flip-chip bonded MMIC. In final manuscript, the electrical characteristics of BCB layer upto mm-Wave region using ring, T resonator method will be included.

Original languageEnglish
Title of host publicationProceedings of the 36th European Microwave Conference, EuMC 2006
PublisherIEEE Computer Society
Pages114-117
Number of pages4
ISBN (Print)2960055160, 9782960055160
DOIs
StatePublished - 2006
Event36th European Microwave Conference, EuMC 2006 - Manchester, United Kingdom
Duration: 10 Sep 200612 Sep 2006

Publication series

NameProceedings of the 36th European Microwave Conference, EuMC 2006

Conference

Conference36th European Microwave Conference, EuMC 2006
Country/TerritoryUnited Kingdom
CityManchester
Period10/09/0612/09/06

Keywords

  • Band pass filter
  • SOP-D
  • V-band

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