Dissolution of Cu into Sn-Based Solders during Reflow Soldering

Jong Hyun Lee; Dong Hyuk Shin; Yong Seog Kim

doi:10.1007/BF03027258

Dissolution of Cu into Sn-Based Solders during Reflow Soldering

Jong Hyun Lee, Dong Hyuk Shin, Yong Seog Kim

Dept. of Materials Science & Engineering

Research output: Contribution to journal › Article › peer-review

5 Scopus citations

Abstract

Cu contents in pure Sn and Sn-37Pb solders were measured as a function of reflowing time. The results indicated that the contents are significantly higher than that of the Cu solubility limit in each solder. Several plausible causes for the excess dissolution of Cu into the solders were explored with experimental observations.

Original language	English
Pages (from-to)	577-581
Number of pages	5
Journal	Metals and Materials International
Volume	9
Issue number	6
DOIs	https://doi.org/10.1007/BF03027258
State	Published - Dec 2003

Keywords

Channel
CuSn
Reflow soldering
Sn-37Pb
Supersaturation

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10.1007/BF03027258

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@article{a2e363550002464caab813208641c262,

title = "Dissolution of Cu into Sn-Based Solders during Reflow Soldering",

abstract = "Cu contents in pure Sn and Sn-37Pb solders were measured as a function of reflowing time. The results indicated that the contents are significantly higher than that of the Cu solubility limit in each solder. Several plausible causes for the excess dissolution of Cu into the solders were explored with experimental observations.",

keywords = "Channel, CuSn, Reflow soldering, Sn-37Pb, Supersaturation",

author = "Lee, \{Jong Hyun\} and Shin, \{Dong Hyuk\} and Kim, \{Yong Seog\}",

year = "2003",

month = dec,

doi = "10.1007/BF03027258",

language = "English",

volume = "9",

pages = "577--581",

journal = "Metals and Materials International",

issn = "1598-9623",

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TY - JOUR

T1 - Dissolution of Cu into Sn-Based Solders during Reflow Soldering

AU - Lee, Jong Hyun

AU - Shin, Dong Hyuk

AU - Kim, Yong Seog

PY - 2003/12

Y1 - 2003/12

N2 - Cu contents in pure Sn and Sn-37Pb solders were measured as a function of reflowing time. The results indicated that the contents are significantly higher than that of the Cu solubility limit in each solder. Several plausible causes for the excess dissolution of Cu into the solders were explored with experimental observations.

AB - Cu contents in pure Sn and Sn-37Pb solders were measured as a function of reflowing time. The results indicated that the contents are significantly higher than that of the Cu solubility limit in each solder. Several plausible causes for the excess dissolution of Cu into the solders were explored with experimental observations.

KW - Channel

KW - CuSn

KW - Reflow soldering

KW - Sn-37Pb

KW - Supersaturation

UR - https://www.scopus.com/pages/publications/1842472853

U2 - 10.1007/BF03027258

DO - 10.1007/BF03027258

M3 - Article

AN - SCOPUS:1842472853

SN - 1598-9623

VL - 9

SP - 577

EP - 581

JO - Metals and Materials International

JF - Metals and Materials International

IS - 6

ER -

Dissolution of Cu into Sn-Based Solders during Reflow Soldering

Abstract

Keywords

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