Dynamic visualizations of flow and meniscus for quadrilateral bump arrangement in capillary underfill process

Seok Hwan Lee, Jaeyong Sung

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This study has investigated the dynamic variations of flow and meniscus during underfill process using flow visualization technique to understand physics of underfill flows. As a quantitative flow visualization technique, μ-PIV(micro particle image velocimetry) was applied. Glycerin was filled into a glass chip which has quadrilateral bump arrangement. It was found that the wetting distance increases rapidly when the meniscus attaches onto the bump and it increases slowly when the meniscus detaches from the bump. The contact angle and the meniscus velocity are in-phase according to the meniscus position. The flow velocity is the fastest between bumps when the meniscus is detached and then the flow velocity continuously gets slow down.

Original languageEnglish
Title of host publicationEPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference
Pages215-219
Number of pages5
DOIs
StatePublished - 2009
Event2009 11th Electronic Packaging Technology Conference, EPTC 2009 - Singapore, Singapore
Duration: 9 Dec 200911 Dec 2009

Publication series

NameProceedings of the Electronic Packaging Technology Conference, EPTC

Conference

Conference2009 11th Electronic Packaging Technology Conference, EPTC 2009
Country/TerritorySingapore
CitySingapore
Period9/12/0911/12/09

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