TY - GEN
T1 - Dynamic visualizations of flow and meniscus for quadrilateral bump arrangement in capillary underfill process
AU - Lee, Seok Hwan
AU - Sung, Jaeyong
PY - 2009
Y1 - 2009
N2 - This study has investigated the dynamic variations of flow and meniscus during underfill process using flow visualization technique to understand physics of underfill flows. As a quantitative flow visualization technique, μ-PIV(micro particle image velocimetry) was applied. Glycerin was filled into a glass chip which has quadrilateral bump arrangement. It was found that the wetting distance increases rapidly when the meniscus attaches onto the bump and it increases slowly when the meniscus detaches from the bump. The contact angle and the meniscus velocity are in-phase according to the meniscus position. The flow velocity is the fastest between bumps when the meniscus is detached and then the flow velocity continuously gets slow down.
AB - This study has investigated the dynamic variations of flow and meniscus during underfill process using flow visualization technique to understand physics of underfill flows. As a quantitative flow visualization technique, μ-PIV(micro particle image velocimetry) was applied. Glycerin was filled into a glass chip which has quadrilateral bump arrangement. It was found that the wetting distance increases rapidly when the meniscus attaches onto the bump and it increases slowly when the meniscus detaches from the bump. The contact angle and the meniscus velocity are in-phase according to the meniscus position. The flow velocity is the fastest between bumps when the meniscus is detached and then the flow velocity continuously gets slow down.
UR - https://www.scopus.com/pages/publications/77950929318
U2 - 10.1109/EPTC.2009.5416549
DO - 10.1109/EPTC.2009.5416549
M3 - Conference contribution
AN - SCOPUS:77950929318
SN - 9781424451005
T3 - Proceedings of the Electronic Packaging Technology Conference, EPTC
SP - 215
EP - 219
BT - EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference
T2 - 2009 11th Electronic Packaging Technology Conference, EPTC 2009
Y2 - 9 December 2009 through 11 December 2009
ER -