Effect of bonding process conditions on the interfacial adhesion energy of Al-Al direct bonds
- Jae Won Kim
- , Myeong Hyeok Jeong
- , Eun Jung Jang
- , Sung Cheol Park
- , Erkan Cakmak
- , Bioh Kim
- , Thorsten Matthias
- , Sungdong Kim
- , Young Bae Park
Research output: Contribution to journal › Article › peer-review