TY - GEN
T1 - Effect of in addition on the reaction and mechanical properties in Sn-Ag-Cu-In solder alloy
AU - Yu, A. Mi
AU - Lee, Chang Woo
AU - Kim, Jeong Han
AU - Kim, Mok Soon
AU - Lee, Jong Hyun
PY - 2007
Y1 - 2007
N2 - This study investigated the reaction and mechanical properties of a In added quaternary composition solder alloy having low Ag content, i.e. Sn-xAg-0.5Cu-yIn to replace the Sn-3.0Ag-0.5Cu composition used widely as a representative Pb-free solder alloy. We found that the In addition of small amount did significantly improve a wettability of the solder at the reflow temperature of 230-240°C. Moreover, the addition did also improve outstandingly the elongation of the solder alloy, thereby increasing the toughness of the alloy. With these results, it was found that if the added amount of In and Ag are optimized, the Sn-Ag-Cu-In quaternary alloy will be a strong candidate for the replacement of Sn-3.0Ag-0.5Cu composition.
AB - This study investigated the reaction and mechanical properties of a In added quaternary composition solder alloy having low Ag content, i.e. Sn-xAg-0.5Cu-yIn to replace the Sn-3.0Ag-0.5Cu composition used widely as a representative Pb-free solder alloy. We found that the In addition of small amount did significantly improve a wettability of the solder at the reflow temperature of 230-240°C. Moreover, the addition did also improve outstandingly the elongation of the solder alloy, thereby increasing the toughness of the alloy. With these results, it was found that if the added amount of In and Ag are optimized, the Sn-Ag-Cu-In quaternary alloy will be a strong candidate for the replacement of Sn-3.0Ag-0.5Cu composition.
UR - https://www.scopus.com/pages/publications/51249095854
U2 - 10.1109/EMAP.2007.4510328
DO - 10.1109/EMAP.2007.4510328
M3 - Conference contribution
AN - SCOPUS:51249095854
SN - 1424419093
SN - 9781424419098
T3 - EMAP 2007 - International Conference on Electronic Materials and Packaging 2007
BT - EMAP 2007- International Conference on Electronic Materials and Packaging 2007
T2 - International Conference on Electronic Materials and Packaging 2007, EMAP 2007
Y2 - 19 November 2007 through 22 November 2007
ER -