Effect of junction temperature swing durations on a lifetime of a transfer molded IGBT module

Ui Min Choi; Frede Blaabjerg; Soren Jorgensen

doi:10.1109/ECCE.2016.7855064

Effect of junction temperature swing durations on a lifetime of a transfer molded IGBT module

Ui Min Choi, Frede Blaabjerg, Soren Jorgensen

Media IT Engineering Program

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

6 Scopus citations

Abstract

In this paper, the effect of junction temperature swing duration on the lifetime of a transfer molded Intelligent Power IGBT Module is studied and a relevant lifetime factor is modeled. A temperature swing duration dependent lifetime factor is defined based on 38 accelerated power cycling test results under 6 different conditions and it may improve a lifetime model for lifetime prediction of IGBT modules under various mission profiles of converters. The power cycling tests are performed by an advanced power cycling test setup which enables tested modules to be operated under more realistic electrical conditions during the power cycling test. The analysis of the test results and the temperature swing duration dependent lifetime factor under different definitions and confidence levels are presented.

Original language	English
Title of host publication	ECCE 2016 - IEEE Energy Conversion Congress and Exposition, Proceedings
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781509007370
DOIs	https://doi.org/10.1109/ECCE.2016.7855064
State	Published - 2016
Event	2016 IEEE Energy Conversion Congress and Exposition, ECCE 2016 - Milwaukee, United States Duration: 18 Sep 2016 → 22 Sep 2016

Publication series

Name	ECCE 2016 - IEEE Energy Conversion Congress and Exposition, Proceedings

Conference

Conference	2016 IEEE Energy Conversion Congress and Exposition, ECCE 2016
Country/Territory	United States
City	Milwaukee
Period	18/09/16 → 22/09/16

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10.1109/ECCE.2016.7855064

Cite this

Choi, U. M., Blaabjerg, F., & Jorgensen, S. (2016). Effect of junction temperature swing durations on a lifetime of a transfer molded IGBT module. In ECCE 2016 - IEEE Energy Conversion Congress and Exposition, Proceedings Article 7855064 (ECCE 2016 - IEEE Energy Conversion Congress and Exposition, Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECCE.2016.7855064

@inproceedings{2dd87c88a45d41c0afd2f3b3043e2f33,

title = "Effect of junction temperature swing durations on a lifetime of a transfer molded IGBT module",

abstract = "In this paper, the effect of junction temperature swing duration on the lifetime of a transfer molded Intelligent Power IGBT Module is studied and a relevant lifetime factor is modeled. A temperature swing duration dependent lifetime factor is defined based on 38 accelerated power cycling test results under 6 different conditions and it may improve a lifetime model for lifetime prediction of IGBT modules under various mission profiles of converters. The power cycling tests are performed by an advanced power cycling test setup which enables tested modules to be operated under more realistic electrical conditions during the power cycling test. The analysis of the test results and the temperature swing duration dependent lifetime factor under different definitions and confidence levels are presented.",

author = "Choi, \{Ui Min\} and Frede Blaabjerg and Soren Jorgensen",

note = "Publisher Copyright: {\textcopyright} 2016 IEEE.; 2016 IEEE Energy Conversion Congress and Exposition, ECCE 2016 ; Conference date: 18-09-2016 Through 22-09-2016",

year = "2016",

doi = "10.1109/ECCE.2016.7855064",

language = "English",

series = "ECCE 2016 - IEEE Energy Conversion Congress and Exposition, Proceedings",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

booktitle = "ECCE 2016 - IEEE Energy Conversion Congress and Exposition, Proceedings",

}

Choi, UM, Blaabjerg, F & Jorgensen, S 2016, Effect of junction temperature swing durations on a lifetime of a transfer molded IGBT module. in ECCE 2016 - IEEE Energy Conversion Congress and Exposition, Proceedings., 7855064, ECCE 2016 - IEEE Energy Conversion Congress and Exposition, Proceedings, Institute of Electrical and Electronics Engineers Inc., 2016 IEEE Energy Conversion Congress and Exposition, ECCE 2016, Milwaukee, United States, 18/09/16. https://doi.org/10.1109/ECCE.2016.7855064

Effect of junction temperature swing durations on a lifetime of a transfer molded IGBT module. / Choi, Ui Min; Blaabjerg, Frede; Jorgensen, Soren.
ECCE 2016 - IEEE Energy Conversion Congress and Exposition, Proceedings. Institute of Electrical and Electronics Engineers Inc., 2016. 7855064 (ECCE 2016 - IEEE Energy Conversion Congress and Exposition, Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Effect of junction temperature swing durations on a lifetime of a transfer molded IGBT module

AU - Choi, Ui Min

AU - Blaabjerg, Frede

AU - Jorgensen, Soren

PY - 2016

Y1 - 2016

N2 - In this paper, the effect of junction temperature swing duration on the lifetime of a transfer molded Intelligent Power IGBT Module is studied and a relevant lifetime factor is modeled. A temperature swing duration dependent lifetime factor is defined based on 38 accelerated power cycling test results under 6 different conditions and it may improve a lifetime model for lifetime prediction of IGBT modules under various mission profiles of converters. The power cycling tests are performed by an advanced power cycling test setup which enables tested modules to be operated under more realistic electrical conditions during the power cycling test. The analysis of the test results and the temperature swing duration dependent lifetime factor under different definitions and confidence levels are presented.

AB - In this paper, the effect of junction temperature swing duration on the lifetime of a transfer molded Intelligent Power IGBT Module is studied and a relevant lifetime factor is modeled. A temperature swing duration dependent lifetime factor is defined based on 38 accelerated power cycling test results under 6 different conditions and it may improve a lifetime model for lifetime prediction of IGBT modules under various mission profiles of converters. The power cycling tests are performed by an advanced power cycling test setup which enables tested modules to be operated under more realistic electrical conditions during the power cycling test. The analysis of the test results and the temperature swing duration dependent lifetime factor under different definitions and confidence levels are presented.

UR - https://www.scopus.com/pages/publications/85015401036

U2 - 10.1109/ECCE.2016.7855064

DO - 10.1109/ECCE.2016.7855064

M3 - Conference contribution

AN - SCOPUS:85015401036

T3 - ECCE 2016 - IEEE Energy Conversion Congress and Exposition, Proceedings

BT - ECCE 2016 - IEEE Energy Conversion Congress and Exposition, Proceedings

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2016 IEEE Energy Conversion Congress and Exposition, ECCE 2016

Y2 - 18 September 2016 through 22 September 2016

ER -

Choi UM, Blaabjerg F, Jorgensen S. Effect of junction temperature swing durations on a lifetime of a transfer molded IGBT module. In ECCE 2016 - IEEE Energy Conversion Congress and Exposition, Proceedings. Institute of Electrical and Electronics Engineers Inc. 2016. 7855064. (ECCE 2016 - IEEE Energy Conversion Congress and Exposition, Proceedings). doi: 10.1109/ECCE.2016.7855064

Effect of junction temperature swing durations on a lifetime of a transfer molded IGBT module

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