Abstract
Effect of post-metallization annealing (PMA) on the quality of the thermally grown SiO2 on 6H- and 4H-SiC has been systematically studied. It is found that under a carefully controlled and optimized PMA condition, it is possible to reduce the effective fixed charge density for both n type and p type 6H- and 4H-SiC. The study covers an annealing temperature range of 400 °C to 600 °C in forming gas (5% hydrogen in nitrogen) for various periods of time. Optimum annealing conditions for both 6H- and 4H-SiC will be reported. Also reported are excellent Dit values for both p type 6H- and p type 4H-SiC/SiO2 structures.
| Original language | English |
|---|---|
| Pages (from-to) | 849-852 |
| Number of pages | 4 |
| Journal | Materials Science Forum |
| Volume | 264-268 |
| Issue number | pt 2 |
| DOIs | |
| State | Published - 1998 |
| Event | Proceedings of the 1997 7th International Conference on Silicon Carbide, III-Nitrides and Related Materials, ICSCIII. Part 1 (of 2) - Stockholm, Sweden Duration: 30 Sep 1997 → … |