Effect of Sn-addition on the bonding strength between casting Au-Pt-Cu alloy and SiO2-based porcelain

S. H. Lee, J. W. Byeon, J. M. Doh, H. N. Lim, J. K. Yoon, H. Y. Jung

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

Effects of 0.5 wt% Sn-addition to the dental casting Au-12Pt-0.6Cu alloy on the interfacial microstructures and bonding strength between porcelain and the alloy were investigated. Porcelain powders (SiO2-based oxides) are bonded through a thermal schedule consisting of preoxidation, 1st firing, and 2nd firing. Interfacial microstructures were examined after pre-oxidation and 2nd firing, respectively, by scanning and transmission electron microscopy. The bonding strength of the Au-12Pt-0.6Cu and Au-12Pt-0.6Cu-0.5Sn alloys with porcelain was about 24.6 MPa and 46.2 MPa, respectively. The higher bonding strength of the Sn-added alloy compared with that of the alloy without Sn is attributed to the SnO2 formed at the interface between porcelain and the alloy during pre-oxidation. SnO2 layer is thought to enhance chemical bonding with various oxides in the porcelain and, accordingly, improve bonding strength.

Original languageEnglish
Title of host publicationEco-Materials Processing and Design VIII - ISEPD-8, Proceedings of the 8th International Symposium on Eco-Materials Processing and Design
PublisherTrans Tech Publications Ltd
Pages175-178
Number of pages4
ISBN (Print)0878494316, 9780878494316
DOIs
StatePublished - 2007
Event8th International Symposium on Eco-Materials Processing and Design, ISEPD-8 - Kitakyushu, Japan
Duration: 11 Jan 200713 Jan 2007

Publication series

NameMaterials Science Forum
Volume544-545
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752

Conference

Conference8th International Symposium on Eco-Materials Processing and Design, ISEPD-8
Country/TerritoryJapan
CityKitakyushu
Period11/01/0713/01/07

Keywords

  • Bonding strength
  • Dental Au-Pt-Cu alloy
  • Porcelain bonding

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