Effects of mold heat transfer coefficient on numerical simulation of injection molding

Eun Min Park, Sun Kyoung Kim

Research output: Contribution to journalArticlepeer-review

11 Scopus citations

Abstract

The convective heat transfer coefficient of the mold is an important parameter in the numerical simulation of the injection molding process, and it significantly affects the results. This influences many factors related to processability including the time required for filling and solidification. This study examines the previous work on this coefficient, including commercial implementations, and explains its characteristics. From real cases, the filling time, solidification time, and pressure distribution have been presented according to this coefficient, and a method for treating it is suggested.

Original languageEnglish
Pages (from-to)201-209
Number of pages9
JournalTransactions of the Korean Society of Mechanical Engineers, B
Volume43
Issue number3
DOIs
StatePublished - 2019

Keywords

  • Heat transfer coefficient
  • Injection molding analysis
  • Mold
  • Thermal resistance

Fingerprint

Dive into the research topics of 'Effects of mold heat transfer coefficient on numerical simulation of injection molding'. Together they form a unique fingerprint.

Cite this