Effects of packaging induced stress on MEMS devices and its improvements

Sung Hoon Choa; Moon Chul Lee; Yong Chul Cho

doi:10.4028/0-87849-415-4.529

Effects of packaging induced stress on MEMS devices and its improvements

Sung Hoon Choa, Moon Chul Lee, Yong Chul Cho

Dept. of Semiconductor Engineering

Samsung

Research output: Contribution to journal › Article › peer-review

Abstract

In MEMS, packaging induced stress or stress induced structure deformation becomes increasing concerns since it directly affects the performance of the device. The conventional MEMS SOI (silicon-on-insulator) gyroscope, packaged using the anodic bonding at the wafer level and EMC (epoxy molding compound) molding, has a deformation of MEMS structure caused by thermal expansion mismatch. Therefore we propose a packaged SiOG (Silicon On Glass) process technology and more robust spring design.

Original language	English
Pages (from-to)	529-532
Number of pages	4
Journal	Key Engineering Materials
Volume	326-328 I
DOIs	https://doi.org/10.4028/0-87849-415-4.529
State	Published - 2006

Keywords

Gyroscope
Packaging induced stress
SiOG process
Warpage

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10.4028/0-87849-415-4.529

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abstract = "In MEMS, packaging induced stress or stress induced structure deformation becomes increasing concerns since it directly affects the performance of the device. The conventional MEMS SOI (silicon-on-insulator) gyroscope, packaged using the anodic bonding at the wafer level and EMC (epoxy molding compound) molding, has a deformation of MEMS structure caused by thermal expansion mismatch. Therefore we propose a packaged SiOG (Silicon On Glass) process technology and more robust spring design.",

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author = "Choa, \{Sung Hoon\} and Lee, \{Moon Chul\} and Cho, \{Yong Chul\}",

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AB - In MEMS, packaging induced stress or stress induced structure deformation becomes increasing concerns since it directly affects the performance of the device. The conventional MEMS SOI (silicon-on-insulator) gyroscope, packaged using the anodic bonding at the wafer level and EMC (epoxy molding compound) molding, has a deformation of MEMS structure caused by thermal expansion mismatch. Therefore we propose a packaged SiOG (Silicon On Glass) process technology and more robust spring design.

KW - Gyroscope

KW - Packaging induced stress

KW - SiOG process

KW - Warpage

UR - https://www.scopus.com/pages/publications/33751503200

U2 - 10.4028/0-87849-415-4.529

DO - 10.4028/0-87849-415-4.529

M3 - Article

AN - SCOPUS:33751503200

SN - 1013-9826

VL - 326-328 I

SP - 529

EP - 532

JO - Key Engineering Materials

JF - Key Engineering Materials

ER -

Effects of packaging induced stress on MEMS devices and its improvements

Abstract

Keywords

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