Enhancement in electrical conductivity of pastes containing submicron Ag-coated Cu filler with palmitic acid surface modification

Eun Byeol Choi; Jong Hyun Lee

doi:10.1016/j.apsusc.2017.01.006

Enhancement in electrical conductivity of pastes containing submicron Ag-coated Cu filler with palmitic acid surface modification

Eun Byeol Choi, Jong Hyun Lee

Dept. of Materials Science & Engineering

Seoul National University of Science and Technology (SNUST)

Research output: Contribution to journal › Article › peer-review

15 Scopus citations

Abstract

The fabrication and applied use of submicron Ag-coated Cu (Cu@Ag) particles as a filler material for epoxy-based conductive pastes having the advantages of a lower material cost and antioxidation behavior were studied. Submicron Cu@Ag particles were successfully prepared and surface-modified using palmitic acid. Diffuse reflectance infrared Fourier transform spectroscopy and thermogravimetric differential scanning calorimetry results indicated the formation of an organic layer by the chemical interaction between the Cu@Ag surface and palmitic acid and the survival of the organic layer after treatment at 160 °C for 3 h in air. The printed pastes containing both commercial micron Cu@Ag flakes and the fabricated submicron Cu@Ag particles showed a greatly reduced electrical resistivity (4.68 × 10 ⁻⁴ Ω cm) after surface modification compared to an initial value of 1.85 × 10 ⁻³ Ω cm when cured.

Original language	English
Pages (from-to)	67-74
Number of pages	8
Journal	Applied Surface Science
Volume	415
DOIs	https://doi.org/10.1016/j.apsusc.2017.01.006
State	Published - 1 Sep 2017

Keywords

Ag-coated Cu
Electrical resistivity
Palmitic acid
Submicron particle
Surface modification

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10.1016/j.apsusc.2017.01.006

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title = "Enhancement in electrical conductivity of pastes containing submicron Ag-coated Cu filler with palmitic acid surface modification",

abstract = " The fabrication and applied use of submicron Ag-coated Cu (Cu@Ag) particles as a filler material for epoxy-based conductive pastes having the advantages of a lower material cost and antioxidation behavior were studied. Submicron Cu@Ag particles were successfully prepared and surface-modified using palmitic acid. Diffuse reflectance infrared Fourier transform spectroscopy and thermogravimetric differential scanning calorimetry results indicated the formation of an organic layer by the chemical interaction between the Cu@Ag surface and palmitic acid and the survival of the organic layer after treatment at 160 °C for 3 h in air. The printed pastes containing both commercial micron Cu@Ag flakes and the fabricated submicron Cu@Ag particles showed a greatly reduced electrical resistivity (4.68 × 10 −4 Ω cm) after surface modification compared to an initial value of 1.85 × 10 −3 Ω cm when cured.",

keywords = "Ag-coated Cu, Electrical resistivity, Palmitic acid, Submicron particle, Surface modification",

author = "Choi, \{Eun Byeol\} and Lee, \{Jong Hyun\}",

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doi = "10.1016/j.apsusc.2017.01.006",

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T1 - Enhancement in electrical conductivity of pastes containing submicron Ag-coated Cu filler with palmitic acid surface modification

AU - Choi, Eun Byeol

AU - Lee, Jong Hyun

PY - 2017/9/1

Y1 - 2017/9/1

N2 - The fabrication and applied use of submicron Ag-coated Cu (Cu@Ag) particles as a filler material for epoxy-based conductive pastes having the advantages of a lower material cost and antioxidation behavior were studied. Submicron Cu@Ag particles were successfully prepared and surface-modified using palmitic acid. Diffuse reflectance infrared Fourier transform spectroscopy and thermogravimetric differential scanning calorimetry results indicated the formation of an organic layer by the chemical interaction between the Cu@Ag surface and palmitic acid and the survival of the organic layer after treatment at 160 °C for 3 h in air. The printed pastes containing both commercial micron Cu@Ag flakes and the fabricated submicron Cu@Ag particles showed a greatly reduced electrical resistivity (4.68 × 10 −4 Ω cm) after surface modification compared to an initial value of 1.85 × 10 −3 Ω cm when cured.

AB - The fabrication and applied use of submicron Ag-coated Cu (Cu@Ag) particles as a filler material for epoxy-based conductive pastes having the advantages of a lower material cost and antioxidation behavior were studied. Submicron Cu@Ag particles were successfully prepared and surface-modified using palmitic acid. Diffuse reflectance infrared Fourier transform spectroscopy and thermogravimetric differential scanning calorimetry results indicated the formation of an organic layer by the chemical interaction between the Cu@Ag surface and palmitic acid and the survival of the organic layer after treatment at 160 °C for 3 h in air. The printed pastes containing both commercial micron Cu@Ag flakes and the fabricated submicron Cu@Ag particles showed a greatly reduced electrical resistivity (4.68 × 10 −4 Ω cm) after surface modification compared to an initial value of 1.85 × 10 −3 Ω cm when cured.

KW - Ag-coated Cu

KW - Electrical resistivity

KW - Palmitic acid

KW - Submicron particle

KW - Surface modification

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DO - 10.1016/j.apsusc.2017.01.006

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SN - 0169-4332

VL - 415

SP - 67

EP - 74

JO - Applied Surface Science

JF - Applied Surface Science

ER -

Enhancement in electrical conductivity of pastes containing submicron Ag-coated Cu filler with palmitic acid surface modification

Abstract

Keywords

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