Erratum: Ambient temperature ultrasonic bonding of Si-dice using Sn-3.5wt.%Ag (Journal of Electronic Materials (March 2008) 37:3 DOI: 10.1007/s11664-007-0341-z)

TY - JOUR

T1 - Erratum

T2 - Ambient temperature ultrasonic bonding of Si-dice using Sn-3.5wt.%Ag (Journal of Electronic Materials (March 2008) 37:3 DOI: 10.1007/s11664-007-0341-z)

AU - Kim, Jung Mo

AU - Jung, Jae Pil

AU - Zhou, Y. Norman

AU - Kim, Jong Hyeong

PY - 2008/8

Y1 - 2008/8

UR - https://www.scopus.com/pages/publications/46749128475

U2 - 10.1007/s11664-008-0488-2

DO - 10.1007/s11664-008-0488-2

M3 - Comment/debate

AN - SCOPUS:46749128475

SN - 0361-5235

VL - 37

SP - 1163

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

IS - 8

ER -