Evaluation of fracture toughness of copper thin films by combining numerical analyses and experimental tests

Hyun Gyu Kim; Se Young Oh; Kwang Soo Kim; Haeng Soo Lee; Seong Woong Kim; Jae Hyun Kim

doi:10.3795/KSME-A.2013.37.2.233

Evaluation of fracture toughness of copper thin films by combining numerical analyses and experimental tests

Hyun Gyu Kim, Se Young Oh, Kwang Soo Kim, Haeng Soo Lee, Seong Woong Kim, Jae Hyun Kim

Dept. of Mechanical & Automotive Engineering

Research output: Contribution to journal › Article › peer-review

Abstract

In this paper, a method of combining numerical analyses and experimental tests is used to evaluate fracture toughness of copper thin films of 15 μm thickness. Far-field loadings of a global-local finite element model are inversely estimated by matching crack opening profiles in experiments with numerical results. The fracture toughness is then evaluated using the J-integral for cracks in thin films under far-field loadings. In experiments, Cu thin films attached to Aluminum sheets are loaded indirectly, and crack opening profiles are observed by microscope camera. Stress versus strain curves of Cu thin films are obtained through micro-tensile tests, and the grain size of Cu thin films is observed by TEM analysis. The results show that the fracture toughness of Cu thin films with 500 nm∼1 μm sized grains is 6, 962 J/m².

Original language	English
Pages (from-to)	233-239
Number of pages	7
Journal	Transactions of the Korean Society of Mechanical Engineers, A
Volume	37
Issue number	2
DOIs	https://doi.org/10.3795/KSME-A.2013.37.2.233
State	Published - Feb 2013

Keywords

Cracl opening profile
Finite element analysis
Fracture toughness
Inverse problems
Thin films

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10.3795/KSME-A.2013.37.2.233

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title = "Evaluation of fracture toughness of copper thin films by combining numerical analyses and experimental tests",

abstract = "In this paper, a method of combining numerical analyses and experimental tests is used to evaluate fracture toughness of copper thin films of 15 μm thickness. Far-field loadings of a global-local finite element model are inversely estimated by matching crack opening profiles in experiments with numerical results. The fracture toughness is then evaluated using the J-integral for cracks in thin films under far-field loadings. In experiments, Cu thin films attached to Aluminum sheets are loaded indirectly, and crack opening profiles are observed by microscope camera. Stress versus strain curves of Cu thin films are obtained through micro-tensile tests, and the grain size of Cu thin films is observed by TEM analysis. The results show that the fracture toughness of Cu thin films with 500 nm∼1 μm sized grains is 6, 962 J/m2.",

keywords = "Cracl opening profile, Finite element analysis, Fracture toughness, Inverse problems, Thin films",

author = "Kim, \{Hyun Gyu\} and Oh, \{Se Young\} and Kim, \{Kwang Soo\} and Lee, \{Haeng Soo\} and Kim, \{Seong Woong\} and Kim, \{Jae Hyun\}",

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doi = "10.3795/KSME-A.2013.37.2.233",

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T1 - Evaluation of fracture toughness of copper thin films by combining numerical analyses and experimental tests

AU - Kim, Hyun Gyu

AU - Oh, Se Young

AU - Kim, Kwang Soo

AU - Lee, Haeng Soo

AU - Kim, Seong Woong

AU - Kim, Jae Hyun

PY - 2013/2

Y1 - 2013/2

N2 - In this paper, a method of combining numerical analyses and experimental tests is used to evaluate fracture toughness of copper thin films of 15 μm thickness. Far-field loadings of a global-local finite element model are inversely estimated by matching crack opening profiles in experiments with numerical results. The fracture toughness is then evaluated using the J-integral for cracks in thin films under far-field loadings. In experiments, Cu thin films attached to Aluminum sheets are loaded indirectly, and crack opening profiles are observed by microscope camera. Stress versus strain curves of Cu thin films are obtained through micro-tensile tests, and the grain size of Cu thin films is observed by TEM analysis. The results show that the fracture toughness of Cu thin films with 500 nm∼1 μm sized grains is 6, 962 J/m2.

AB - In this paper, a method of combining numerical analyses and experimental tests is used to evaluate fracture toughness of copper thin films of 15 μm thickness. Far-field loadings of a global-local finite element model are inversely estimated by matching crack opening profiles in experiments with numerical results. The fracture toughness is then evaluated using the J-integral for cracks in thin films under far-field loadings. In experiments, Cu thin films attached to Aluminum sheets are loaded indirectly, and crack opening profiles are observed by microscope camera. Stress versus strain curves of Cu thin films are obtained through micro-tensile tests, and the grain size of Cu thin films is observed by TEM analysis. The results show that the fracture toughness of Cu thin films with 500 nm∼1 μm sized grains is 6, 962 J/m2.

KW - Cracl opening profile

KW - Finite element analysis

KW - Fracture toughness

KW - Inverse problems

KW - Thin films

UR - https://www.scopus.com/pages/publications/84874818600

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M3 - Article

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SN - 1226-4873

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JO - Transactions of the Korean Society of Mechanical Engineers, A

JF - Transactions of the Korean Society of Mechanical Engineers, A

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ER -

Evaluation of fracture toughness of copper thin films by combining numerical analyses and experimental tests

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Keywords

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