Evaluation procedures for wafer bonding and thinning of interconnect test structures for 3D ICs

  • J. Q. Lu
  • , A. Jindal
  • , Y. Kwon
  • , J. J. McMahon
  • , M. Rasco
  • , R. Augur
  • , T. S. Cale
  • , R. J. Gutmann

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

56 Scopus citations

Fingerprint

Dive into the research topics of 'Evaluation procedures for wafer bonding and thinning of interconnect test structures for 3D ICs'. Together they form a unique fingerprint.

Engineering

Material Science

Medicine and Dentistry