Evaluation procedures for wafer bonding and thinning of interconnect test structures for 3D ICs
- J. Q. Lu
- , A. Jindal
- , Y. Kwon
- , J. J. McMahon
- , M. Rasco
- , R. Augur
- , T. S. Cale
- , R. J. Gutmann
- Rensselaer Polytechnic Institute
- SEMATECH
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
56
Scopus
citations