Experimental and numerical analysis of polymer deformation in thermal nanoimprint lithography

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

Nanoimprint lithography has been widely used in various applications as a promising micro/nano fabrication tool. In the thermal nanoimprint process, optimization of important process parameters such as temperature, pressure, and pressure holding time is greatly needed to successfully imprint micro- and nano-scale patterns in a resist material. In this study, both experimentation and numerical simulation were performed to extend the understanding of the behaviour of polymer materials and to optimize process condition effectively during the thermal imprint process. The effects of the process conditions on the polymer deformation are discussed to achieve a rapid and high throughput thermal imprint process.

Original languageEnglish
Title of host publicationProceedings of Precision Engineering and Nanotechnology
PublisherTrans Tech Publications Ltd
Pages269-274
Number of pages6
ISBN (Print)9783037854280
DOIs
StatePublished - 2012
Event4th International Conference of Asian Society for Precision Engineering and Nanotechnology, ASPEN 2011 - Hong Kong, China
Duration: 16 Nov 201118 Nov 2011

Publication series

NameKey Engineering Materials
Volume516
ISSN (Print)1013-9826
ISSN (Electronic)1662-9795

Conference

Conference4th International Conference of Asian Society for Precision Engineering and Nanotechnology, ASPEN 2011
Country/TerritoryChina
CityHong Kong
Period16/11/1118/11/11

Keywords

  • Finite element analysis
  • Nanoimprint
  • PMMA
  • Polymer
  • Viscoelastic

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