Abstract
Nanoimprint lithography has been widely used in various applications as a promising micro/nano fabrication tool. In the thermal nanoimprint process, optimization of important process parameters such as temperature, pressure, and pressure holding time is greatly needed to successfully imprint micro- and nano-scale patterns in a resist material. In this study, both experimentation and numerical simulation were performed to extend the understanding of the behaviour of polymer materials and to optimize process condition effectively during the thermal imprint process. The effects of the process conditions on the polymer deformation are discussed to achieve a rapid and high throughput thermal imprint process.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of Precision Engineering and Nanotechnology |
| Publisher | Trans Tech Publications Ltd |
| Pages | 269-274 |
| Number of pages | 6 |
| ISBN (Print) | 9783037854280 |
| DOIs | |
| State | Published - 2012 |
| Event | 4th International Conference of Asian Society for Precision Engineering and Nanotechnology, ASPEN 2011 - Hong Kong, China Duration: 16 Nov 2011 → 18 Nov 2011 |
Publication series
| Name | Key Engineering Materials |
|---|---|
| Volume | 516 |
| ISSN (Print) | 1013-9826 |
| ISSN (Electronic) | 1662-9795 |
Conference
| Conference | 4th International Conference of Asian Society for Precision Engineering and Nanotechnology, ASPEN 2011 |
|---|---|
| Country/Territory | China |
| City | Hong Kong |
| Period | 16/11/11 → 18/11/11 |
UN SDGs
This output contributes to the following UN Sustainable Development Goals (SDGs)
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SDG 9 Industry, Innovation, and Infrastructure
Keywords
- Finite element analysis
- Nanoimprint
- PMMA
- Polymer
- Viscoelastic
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