Experimental characterization of TSV liquid cooling for 3D integration

Manseok Park; Sungdong Kim; Sarah Eunkyung Kim

doi:10.1109/IITC-MAM.2015.7325660

Experimental characterization of TSV liquid cooling for 3D integration

Seoul National University of Science and Technology (SNUST)

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Scopus citations

Abstract

The development of 3D integration causes the major technology paradigm shift to all of IC devices, interconnects, and packages. Despite the benefits of 3D integration, it faces a key challenge of thermal management, especially for high power and high density devices. Due to the limitation of conventional thermal solutions, a liquid cooling method is of great interest. In this study the direct liquid cooling module with different TSVs and microchannel has been designed and fabricated. Pressure drop and temperature differential of liquid cooling module were investigated experimentally.

Original language	English
Title of host publication	2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	241-243
Number of pages	3
ISBN (Electronic)	9781467373562
DOIs	https://doi.org/10.1109/IITC-MAM.2015.7325660
State	Published - 10 Nov 2015
Event	IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015 - Grenoble, France Duration: 18 May 2015 → 21 May 2015

Publication series

Name	2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015

Conference

Conference	IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015
Country/Territory	France
City	Grenoble
Period	18/05/15 → 21/05/15

Keywords

Decision support systems
Liquid cooling
Microchannels
Thermal management
Three-dimensional displays
Through-silicon vias

Access to Document

10.1109/IITC-MAM.2015.7325660

Cite this

Park, M., Kim, S., & Kim, S. E. (2015). Experimental characterization of TSV liquid cooling for 3D integration. In 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015 (pp. 241-243). Article 7325660 (2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IITC-MAM.2015.7325660

Park, Manseok ; Kim, Sungdong ; Kim, Sarah Eunkyung. / Experimental characterization of TSV liquid cooling for 3D integration. 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015. Institute of Electrical and Electronics Engineers Inc., 2015. pp. 241-243 (2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015).

@inproceedings{a0b093371f6f4f589a61293484733262,

title = "Experimental characterization of TSV liquid cooling for 3D integration",

abstract = "The development of 3D integration causes the major technology paradigm shift to all of IC devices, interconnects, and packages. Despite the benefits of 3D integration, it faces a key challenge of thermal management, especially for high power and high density devices. Due to the limitation of conventional thermal solutions, a liquid cooling method is of great interest. In this study the direct liquid cooling module with different TSVs and microchannel has been designed and fabricated. Pressure drop and temperature differential of liquid cooling module were investigated experimentally.",

keywords = "Decision support systems, Liquid cooling, Microchannels, Thermal management, Three-dimensional displays, Through-silicon vias",

author = "Manseok Park and Sungdong Kim and Kim, \{Sarah Eunkyung\}",

note = "Publisher Copyright: {\textcopyright} 2015 IEEE.; IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015 ; Conference date: 18-05-2015 Through 21-05-2015",

year = "2015",

month = nov,

day = "10",

doi = "10.1109/IITC-MAM.2015.7325660",

language = "English",

series = "2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "241--243",

booktitle = "2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015",

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Park, M, Kim, S & Kim, SE 2015, Experimental characterization of TSV liquid cooling for 3D integration. in 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015., 7325660, 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015, Institute of Electrical and Electronics Engineers Inc., pp. 241-243, IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015, Grenoble, France, 18/05/15. https://doi.org/10.1109/IITC-MAM.2015.7325660

Experimental characterization of TSV liquid cooling for 3D integration. / Park, Manseok; Kim, Sungdong ; Kim, Sarah Eunkyung.
2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015. Institute of Electrical and Electronics Engineers Inc., 2015. p. 241-243 7325660 (2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Experimental characterization of TSV liquid cooling for 3D integration

AU - Park, Manseok

AU - Kim, Sungdong

AU - Kim, Sarah Eunkyung

PY - 2015/11/10

Y1 - 2015/11/10

N2 - The development of 3D integration causes the major technology paradigm shift to all of IC devices, interconnects, and packages. Despite the benefits of 3D integration, it faces a key challenge of thermal management, especially for high power and high density devices. Due to the limitation of conventional thermal solutions, a liquid cooling method is of great interest. In this study the direct liquid cooling module with different TSVs and microchannel has been designed and fabricated. Pressure drop and temperature differential of liquid cooling module were investigated experimentally.

AB - The development of 3D integration causes the major technology paradigm shift to all of IC devices, interconnects, and packages. Despite the benefits of 3D integration, it faces a key challenge of thermal management, especially for high power and high density devices. Due to the limitation of conventional thermal solutions, a liquid cooling method is of great interest. In this study the direct liquid cooling module with different TSVs and microchannel has been designed and fabricated. Pressure drop and temperature differential of liquid cooling module were investigated experimentally.

KW - Decision support systems

KW - Liquid cooling

KW - Microchannels

KW - Thermal management

KW - Three-dimensional displays

KW - Through-silicon vias

UR - https://www.scopus.com/pages/publications/84961875071

U2 - 10.1109/IITC-MAM.2015.7325660

DO - 10.1109/IITC-MAM.2015.7325660

M3 - Conference contribution

AN - SCOPUS:84961875071

T3 - 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015

SP - 241

EP - 243

BT - 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015

Y2 - 18 May 2015 through 21 May 2015

ER -

Park M, Kim S , Kim SE. Experimental characterization of TSV liquid cooling for 3D integration. In 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015. Institute of Electrical and Electronics Engineers Inc. 2015. p. 241-243. 7325660. (2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015). doi: 10.1109/IITC-MAM.2015.7325660

Experimental characterization of TSV liquid cooling for 3D integration

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