TY - GEN
T1 - Exploring the Potential of Fly Cutting for Polymer Planarization in Cu/PDMS Hybrid Bonding
AU - Jang, Suin
AU - Choi, Junyoung
AU - Lee, Dongmyeong
AU - Lee, Hoogwan
AU - Kim, Sarah Eunkyung
N1 - Publisher Copyright:
© 2025 Japan Institute of Electronics Packaging.
PY - 2025
Y1 - 2025
N2 - 3D packaging technology has been rapidly advancing to meet the demands of high-performance computing, and the importance of hybrid bonding is increasingly emphasized. Cu/polymer hybrid bonding offers advantages such as flexibility and simplified processing. This study explores the feasibility of applying fly cutting for co-planarizing Cu/PDMS in hybrid bonding. Experimental results show that fly cutting achieves an extremely low roughness of less than 1 nm on Cu surfaces and a roughness of approximately 6-7 nm on PDMS surfaces. However, achieving optimal planarization for soft polymers like PDMS remains a significant challenge. This study demonstrates the potential and limitations of fly cutting for Cu/polymer hybrid bonding and provides insights into future research directions aimed at process optimization.
AB - 3D packaging technology has been rapidly advancing to meet the demands of high-performance computing, and the importance of hybrid bonding is increasingly emphasized. Cu/polymer hybrid bonding offers advantages such as flexibility and simplified processing. This study explores the feasibility of applying fly cutting for co-planarizing Cu/PDMS in hybrid bonding. Experimental results show that fly cutting achieves an extremely low roughness of less than 1 nm on Cu surfaces and a roughness of approximately 6-7 nm on PDMS surfaces. However, achieving optimal planarization for soft polymers like PDMS remains a significant challenge. This study demonstrates the potential and limitations of fly cutting for Cu/polymer hybrid bonding and provides insights into future research directions aimed at process optimization.
KW - 3D packaging Technology
KW - Cu/Polymer Hybrid Bonding
KW - Fly Cutting
KW - Polymer Planarization
UR - https://www.scopus.com/pages/publications/105007510519
U2 - 10.23919/ICEP-IAAC64884.2025.11002923
DO - 10.23919/ICEP-IAAC64884.2025.11002923
M3 - Conference contribution
AN - SCOPUS:105007510519
T3 - 2025 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2025
SP - 267
EP - 268
BT - 2025 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2025
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 24th International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2025
Y2 - 15 April 2025 through 19 April 2025
ER -