Fabrication of a Conductive Pattern on a Photo-Polymerized Structure Using Direct Laser Sintering

Three-dimensional (3D)-printed electronic technology is considered to have great potential as it can be utilized to make electronic products with complex 3D shapes. In this study, based on a 3D printer with single UV laser equipment, we continuously performed photo-polymerization (PP) and selective metal powder sintering to fabricate a conductive pattern. For this, 3D structures were printed at a low energy using a 355 nm DPSS laser with a galvanometer scanner, which are widely used in PP-type 3D printing, and then the selective sintering of metal powders was performed with a high energy. In order to obtain a high-conductivity pattern by laser sintering, a circuit pattern that could actually be operated was fabricated by experimenting with various condition changes from mixing the metal composite resin to the laser process. As a result, it was found that the optimal result was to irradiate a 0.8 W UV laser with a beam spot size of 50 µm to 50 vol% aluminum composite resin. At this time, an optimal conductive pattern with a resistance of 0.33 Ω∙cm⁻¹ was obtained by setting the pulse repetition rate, scan path interval, and scanning speed to 90 kHz, 10 μm, and 50 mm/s, respectively. This suggested process may be of great help in the manufacturing of practical 3D sensors or functional products in the future.