TY - JOUR
T1 - Fabrication of PMMA acoustophoretic microfluidic chip using plasma assisted bonding
AU - Yoon, Ryu Ri
AU - Kim, Sung Man
AU - Han, Arum
AU - Cho, Young Hak
PY - 2017/5
Y1 - 2017/5
N2 - In this paper, we propose a simple and low-cost fabrication method for PMMA (Poly (Methyl Methacrylate)) acoustophoretic microfluidic chips using plasma-assisted bonding followed by MEMS (Microelectromechanical Systems) processes. A metal mold for replicating the PMMA polymer was fabricated using MEMS processes, and the microfluidic channel was imprinted on the PMMA polymer using a hot-embossing process. The closed fabricated microfluidic channel was achieved by means of the plasma-assisted bonding between the PMMA channel and the flat PMMA cover. The plasma treatment and hotembossing conditions for PMMA-PMMA bonding were studied and evaluated. The particle separation test confirmed that the PMMA acoustophoretic microfluidic chips could be used. We expect the Si-based acoustophoretic microfluidic chip to be replaced by the presented polymer chip in such applications as blood or droplet separation.
AB - In this paper, we propose a simple and low-cost fabrication method for PMMA (Poly (Methyl Methacrylate)) acoustophoretic microfluidic chips using plasma-assisted bonding followed by MEMS (Microelectromechanical Systems) processes. A metal mold for replicating the PMMA polymer was fabricated using MEMS processes, and the microfluidic channel was imprinted on the PMMA polymer using a hot-embossing process. The closed fabricated microfluidic channel was achieved by means of the plasma-assisted bonding between the PMMA channel and the flat PMMA cover. The plasma treatment and hotembossing conditions for PMMA-PMMA bonding were studied and evaluated. The particle separation test confirmed that the PMMA acoustophoretic microfluidic chips could be used. We expect the Si-based acoustophoretic microfluidic chip to be replaced by the presented polymer chip in such applications as blood or droplet separation.
KW - Acoustic standing wave
KW - Acoustophoretic chip
KW - Hot-embossing process
KW - Particle separation
KW - Plasma assisted bonding
UR - http://www.scopus.com/inward/record.url?scp=85021208809&partnerID=8YFLogxK
U2 - 10.7736/KSPE.2017.34.5.343
DO - 10.7736/KSPE.2017.34.5.343
M3 - Article
AN - SCOPUS:85021208809
SN - 1225-9071
VL - 34
SP - 343
EP - 347
JO - Journal of the Korean Society for Precision Engineering
JF - Journal of the Korean Society for Precision Engineering
IS - 5
ER -