Fast fabrication of conductive copper structure on glass material using laser-induced chemical liquid phase deposition

Glass is a very stable material at room temperature and has good resistance to gas, bacteria, and organisms. Due to the development of the electronic industry, the industrial demand for creating a conductive pattern on glass is increasing rapidly. To create conductive circuit patterns on the glass surface, non-contact methods based on high energy sources or chemical methods are generally used. However, these methods have disadvantages such as low conductivity, high cost, and size limitations. Processes such as LCLD (laser-induced chemical liquid phase deposition) have been widely studied to solve this problem. However, it has a fatal disadvantage of being slow. Therefore, in this study, various process changes were attempted to improve productivity and conductivity. In particular, sufficient thermal energy was supplied with high laser power for a stable chemical reduction, and the scanning path was changed in various shapes to minimize the ablation that occurs at this time. Through this, it was possible to disperse the overlapped laser energy of high power to widen the activation area of the reduction reaction. With this proposed LCLD process, it is possible to achieve good productivity and fabricate conductive circuit patterns faster than in previous studies.