TY - GEN
T1 - Fingerprint imaging using capacitive micromachined ultrasonic transducer impediography with glass waveguide
AU - Kwak, Yun Sang
AU - Choi, Won Young
AU - Park, Kwan Kyu
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/10/31
Y1 - 2017/10/31
N2 - Ultrasonic techniques for fingerprint imaging are emerging as an important alternative technology to the traditional capacitive methods. Recently, a pulse-echo based method using a solid interface layer with a waveguide has been investigated for fingerprint imaging. In addition, an impediography method was previously investigated by measuring the pulse damping of the contact area. Both methods require a complex pulse excitation circuit and short pulse duration. In this work, we present an impediography-based implementation, wherein the fingerprint image was acquired by measuring the device impedance instead of the pulse. By using a pseudo-continuous wave (CW) AC signal, we have performed fingerprint imaging, using a waveguide.
AB - Ultrasonic techniques for fingerprint imaging are emerging as an important alternative technology to the traditional capacitive methods. Recently, a pulse-echo based method using a solid interface layer with a waveguide has been investigated for fingerprint imaging. In addition, an impediography method was previously investigated by measuring the pulse damping of the contact area. Both methods require a complex pulse excitation circuit and short pulse duration. In this work, we present an impediography-based implementation, wherein the fingerprint image was acquired by measuring the device impedance instead of the pulse. By using a pseudo-continuous wave (CW) AC signal, we have performed fingerprint imaging, using a waveguide.
UR - https://www.scopus.com/pages/publications/85039461379
U2 - 10.1109/ULTSYM.2017.8091582
DO - 10.1109/ULTSYM.2017.8091582
M3 - Conference contribution
AN - SCOPUS:85039461379
T3 - IEEE International Ultrasonics Symposium, IUS
BT - 2017 IEEE International Ultrasonics Symposium, IUS 2017
PB - IEEE Computer Society
T2 - 2017 IEEE International Ultrasonics Symposium, IUS 2017
Y2 - 6 September 2017 through 9 September 2017
ER -