Fully encapsulated sub-millimeter accelerometers

Woo Tae Park; Rob N. Candler; Vipin Ayanoor-Vitikkate; Markus Lutz; Aaron Partridge; Gary Yama; Thomas W. Kenny

Fully encapsulated sub-millimeter accelerometers

Woo Tae Park, Rob N. Candler, Vipin Ayanoor-Vitikkate, Markus Lutz, Aaron Partridge, Gary Yama, Thomas W. Kenny

Dept. of Mechanical & Automotive Engineering

Research output: Contribution to journal › Conference article › peer-review

6 Scopus citations

Abstract

In this paper we present design, fabrication, and characterization results for the smallest published fully-packaged accelerometers. The miniaturization is realized by utilizing an advanced packaging scheme using a thick film epitaxial grown polysilicon encapsulation technique. Using this approach, released, encapsulated MEMS devices can be fabricated with exterior dimensions only 10s of microns larger than the micromechanical element. This advantage enables us to make accelerometers almost 2 orders of magnitude smaller than others. We have fabricated accelerometers as small as 0.034mm³ (387×387× 230μm) with noise floor of 0.25mg/sqrt(Hz).

Original language	English
Article number	TPa26
Pages (from-to)	347-350
Number of pages	4
Journal	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
State	Published - 2005
Event	18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami - Miami Beach, FL, United States Duration: 30 Jan 2005 → 3 Feb 2005

Cite this

@article{7ff58ebabbdb413781d17caf7c2be707,

title = "Fully encapsulated sub-millimeter accelerometers",

abstract = "In this paper we present design, fabrication, and characterization results for the smallest published fully-packaged accelerometers. The miniaturization is realized by utilizing an advanced packaging scheme using a thick film epitaxial grown polysilicon encapsulation technique. Using this approach, released, encapsulated MEMS devices can be fabricated with exterior dimensions only 10s of microns larger than the micromechanical element. This advantage enables us to make accelerometers almost 2 orders of magnitude smaller than others. We have fabricated accelerometers as small as 0.034mm3 (387×387× 230μm) with noise floor of 0.25mg/sqrt(Hz).",

author = "Park, \{Woo Tae\} and Candler, \{Rob N.\} and Vipin Ayanoor-Vitikkate and Markus Lutz and Aaron Partridge and Gary Yama and Kenny, \{Thomas W.\}",

year = "2005",

language = "English",

pages = "347--350",

journal = "Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)",

issn = "1084-6999",

note = "18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami ; Conference date: 30-01-2005 Through 03-02-2005",

}

TY - JOUR

T1 - Fully encapsulated sub-millimeter accelerometers

AU - Park, Woo Tae

AU - Candler, Rob N.

AU - Ayanoor-Vitikkate, Vipin

AU - Lutz, Markus

AU - Partridge, Aaron

AU - Yama, Gary

AU - Kenny, Thomas W.

PY - 2005

Y1 - 2005

N2 - In this paper we present design, fabrication, and characterization results for the smallest published fully-packaged accelerometers. The miniaturization is realized by utilizing an advanced packaging scheme using a thick film epitaxial grown polysilicon encapsulation technique. Using this approach, released, encapsulated MEMS devices can be fabricated with exterior dimensions only 10s of microns larger than the micromechanical element. This advantage enables us to make accelerometers almost 2 orders of magnitude smaller than others. We have fabricated accelerometers as small as 0.034mm3 (387×387× 230μm) with noise floor of 0.25mg/sqrt(Hz).

AB - In this paper we present design, fabrication, and characterization results for the smallest published fully-packaged accelerometers. The miniaturization is realized by utilizing an advanced packaging scheme using a thick film epitaxial grown polysilicon encapsulation technique. Using this approach, released, encapsulated MEMS devices can be fabricated with exterior dimensions only 10s of microns larger than the micromechanical element. This advantage enables us to make accelerometers almost 2 orders of magnitude smaller than others. We have fabricated accelerometers as small as 0.034mm3 (387×387× 230μm) with noise floor of 0.25mg/sqrt(Hz).

UR - https://www.scopus.com/pages/publications/26844517522

M3 - Conference article

AN - SCOPUS:26844517522

SN - 1084-6999

SP - 347

EP - 350

JO - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

JF - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

M1 - TPa26

T2 - 18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami

Y2 - 30 January 2005 through 3 February 2005

ER -

Fully encapsulated sub-millimeter accelerometers

Abstract

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