Hydrazine vapor-based rapid and low temperature post-processing for inkjet printed conductive copper patterns

Young In Lee; Young Tae Kwon; Seil Kim; Kun Jae Lee; Yong Ho Choa

doi:10.1016/j.tsf.2016.08.032

Hydrazine vapor-based rapid and low temperature post-processing for inkjet printed conductive copper patterns

Young In Lee
, Young Tae Kwon
, Seil Kim
, Kun Jae Lee
, Yong Ho Choa

Dept. of Materials Science & Engineering

Hanyang University
Dankook University

Research output: Contribution to journal › Article › peer-review

4 Scopus citations

Abstract

We present a useful and effective conversion process for inkjet-printed conductive copper features on common polymer substrates. The process is based on causing burst nucleation from an as-printed copper complex ion pattern by an exposure to hydrazine vapor. This hydrazine based treatment at 150 °C for 1 min leads to copper patterns with a well-sintered microstructure and resistivity of 15.18 μΩ cm. This new approach could be an alternative to a conventional hydrogen gas treatment and is suitable for organometallic or metal complex based inks as well as most commercial plastic and paper substrates for flexible and disposable electronics.

Original language	English
Pages (from-to)	260-264
Number of pages	5
Journal	Thin Solid Films
Volume	616
DOIs	https://doi.org/10.1016/j.tsf.2016.08.032
State	Published - 1 Oct 2016

Keywords

Conductive features
Copper
Hydrazine vapor
Inkjet printing
Sintering

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10.1016/j.tsf.2016.08.032

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title = "Hydrazine vapor-based rapid and low temperature post-processing for inkjet printed conductive copper patterns",

abstract = "We present a useful and effective conversion process for inkjet-printed conductive copper features on common polymer substrates. The process is based on causing burst nucleation from an as-printed copper complex ion pattern by an exposure to hydrazine vapor. This hydrazine based treatment at 150 °C for 1 min leads to copper patterns with a well-sintered microstructure and resistivity of 15.18 μΩ cm. This new approach could be an alternative to a conventional hydrogen gas treatment and is suitable for organometallic or metal complex based inks as well as most commercial plastic and paper substrates for flexible and disposable electronics.",

keywords = "Conductive features, Copper, Hydrazine vapor, Inkjet printing, Sintering",

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T1 - Hydrazine vapor-based rapid and low temperature post-processing for inkjet printed conductive copper patterns

AU - Lee, Young In

AU - Kwon, Young Tae

AU - Kim, Seil

AU - Lee, Kun Jae

AU - Choa, Yong Ho

PY - 2016/10/1

Y1 - 2016/10/1

N2 - We present a useful and effective conversion process for inkjet-printed conductive copper features on common polymer substrates. The process is based on causing burst nucleation from an as-printed copper complex ion pattern by an exposure to hydrazine vapor. This hydrazine based treatment at 150 °C for 1 min leads to copper patterns with a well-sintered microstructure and resistivity of 15.18 μΩ cm. This new approach could be an alternative to a conventional hydrogen gas treatment and is suitable for organometallic or metal complex based inks as well as most commercial plastic and paper substrates for flexible and disposable electronics.

AB - We present a useful and effective conversion process for inkjet-printed conductive copper features on common polymer substrates. The process is based on causing burst nucleation from an as-printed copper complex ion pattern by an exposure to hydrazine vapor. This hydrazine based treatment at 150 °C for 1 min leads to copper patterns with a well-sintered microstructure and resistivity of 15.18 μΩ cm. This new approach could be an alternative to a conventional hydrogen gas treatment and is suitable for organometallic or metal complex based inks as well as most commercial plastic and paper substrates for flexible and disposable electronics.

KW - Conductive features

KW - Copper

KW - Hydrazine vapor

KW - Inkjet printing

KW - Sintering

UR - https://www.scopus.com/pages/publications/84983685059

U2 - 10.1016/j.tsf.2016.08.032

DO - 10.1016/j.tsf.2016.08.032

M3 - Article

AN - SCOPUS:84983685059

SN - 0040-6090

VL - 616

SP - 260

EP - 264

JO - Thin Solid Films

JF - Thin Solid Films

ER -

Hydrazine vapor-based rapid and low temperature post-processing for inkjet printed conductive copper patterns

Abstract

Keywords

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