Improved Initial Growth Behavior of SrO and SrTiO3 Films Grown by Atomic Layer Deposition Using {Sr(demamp)(tmhd)}2 as Sr-Precursor

Woongkyu Lee, Woojin Jeon, Cheol Hyun An, Min Jung Chung, Han Joon Kim, Taeyong Eom, Sheby Mary George, Bo Keun Park, Jeong Hwan Han, Chang Gyoun Kim, Taek Mo Chung, Sang Woon Lee, Cheol Seong Hwang

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Abstract

An atomic layer deposition (ALD) process for SrTiO3 (STO) thin film growth was developed using a newly designed and synthesized heteroleptic Sr-precursor, {Sr(demamp)(tmhd)}2 (demampH = 1-{[2-(dimethylamino)ethyl](methyl)amino}-2-methylpropan-2-ol, tmhdH = 2,2,6,6-tetramethyl-3,5-heptanedione), which offered an intermediate reactivity toward oxygen between Sr(tmhd)2 and Sr(iPr3Cp)2. Because of the appropriate reactivity of {Sr(demamp)(tmhd)}2 toward oxygen, the abnormal initial growth behavior (due to interaction between the Sr-precursor and active oxygen contained in the underlying oxidized Ru layer) became negligible during the growth of the SrO and STO films on the Ru electrode, which allowed the growth of the SrO and STO films to be highly controllable with a moderate growth rate. Using Ti(CpMe5)(OMe)3 as the Ti-precursor and O3 as the oxygen source in the TiO2 ALD subcycle, the ALD process of the STO film revealed a growth rate of 0.05 nm/cycle and ∼85% of step coverage in terms of the thickness and cation composition on a capacitor hole structure with an aspect ratio of 10 (opening diameter of 100 nm and depth of 1 μm). The minimum achievable equivalent oxide thickness (tox) with a low leakage current (<10-7 A/cm2 at 0.8 V) was limited to 0.46 nm. The damage effect on the underlying Ru electrode by the prolonged ALD process time appears to affect the limited scalability of tox.

Original languageEnglish
Pages (from-to)3881-3891
Number of pages11
JournalChemistry of Materials
Volume27
Issue number11
DOIs
StatePublished - 9 Jun 2015

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