TY - GEN
T1 - Improved reliability of Sn-Ag-Cu-In solder alloy by the addition of minor elements
AU - Yu, A. Mi
AU - Jang, Jae Won
AU - Kim, Jun Ki
AU - Lee, Jong Hyun
AU - Kim, Mok Soon
PY - 2010
Y1 - 2010
N2 - Among the various Pb-free solder alloys, Sn-3.0Ag-0.5Cu has been an industrial standard in consumer electronics due to its moderate wetting behavior and reliability in thermal fatigue. Recently, however, its high material cost and low reliability in drop impact condition resulted in the use of Sn- 0.3Ag-0.7Cu and the development of Sn-1.2Ag-0.7Cu-0.4In solder alloys. Authors have reported that the Sn-1.2Ag-0.7Cu- 0.4In showed as good wettability as Sn-3.0Ag-0.5Cu and load drop reliability as Sn-1.0Ag-0.5Cu. It was believed that the small addition of In could make up for the large reduction of Ag with the material cost benefit of about 20%. It was also noteworthy that the load drop reliability of Sn-1.2Ag-0.7Cu- 0.4In could be improved beyond Sn-1.0Ag-0.5Cu by the small addition of some elements. In this study, effects of the minor elements, on the reaction, mechanical properties and reliability were investigated.
AB - Among the various Pb-free solder alloys, Sn-3.0Ag-0.5Cu has been an industrial standard in consumer electronics due to its moderate wetting behavior and reliability in thermal fatigue. Recently, however, its high material cost and low reliability in drop impact condition resulted in the use of Sn- 0.3Ag-0.7Cu and the development of Sn-1.2Ag-0.7Cu-0.4In solder alloys. Authors have reported that the Sn-1.2Ag-0.7Cu- 0.4In showed as good wettability as Sn-3.0Ag-0.5Cu and load drop reliability as Sn-1.0Ag-0.5Cu. It was believed that the small addition of In could make up for the large reduction of Ag with the material cost benefit of about 20%. It was also noteworthy that the load drop reliability of Sn-1.2Ag-0.7Cu- 0.4In could be improved beyond Sn-1.0Ag-0.5Cu by the small addition of some elements. In this study, effects of the minor elements, on the reaction, mechanical properties and reliability were investigated.
UR - http://www.scopus.com/inward/record.url?scp=77955187212&partnerID=8YFLogxK
U2 - 10.1109/ECTC.2010.5490792
DO - 10.1109/ECTC.2010.5490792
M3 - Conference contribution
AN - SCOPUS:77955187212
SN - 9781424464104
T3 - Proceedings - Electronic Components and Technology Conference
SP - 1524
EP - 1528
BT - 2010 Proceedings 60th Electronic Components and Technology Conference, ECTC 2010
T2 - 60th Electronic Components and Technology Conference, ECTC 2010
Y2 - 1 June 2010 through 4 June 2010
ER -