Abstract
It is demonstrated that the dielectric constant of Al 2O 3 is significantly increased through the addition of a very small amount of La into Al 2O 3 followed by a high-temperature post-deposition annealing (PDA). The retention property and reliability of the charge trap flash memory devices fabricated through the proposed method are greatly improved due to the increased κ-value of the Al 2O 3 blocking oxide with no sacrifice of the bandgap, as well as a reduced low-field leakage component and improved dielectric relaxation effect.
| Original language | English |
|---|---|
| Article number | 081102 |
| Journal | Applied Physics Express |
| Volume | 5 |
| Issue number | 8 |
| DOIs | |
| State | Published - Aug 2012 |