TY - GEN
T1 - Influence of Current Distribution Variations on Contact Resistance Measurement in Cu-Cu Bonding Interface
AU - Shin, Kyoung Min
AU - Park, Jong Kyung
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - This paper evaluates the current distribution characteristics in the CBKR(Cross-Bridge-Kelvin-Resistor) structure and SGC (Stacked-Greek-Cross) structure designed to extract contact resistance occurring at the Cu-Cu bonding interfaces. We investigated a method to accurately extract contact resistance using Electromagnetic (EM) simulation. The current distribution varies depending on the thickness of the copper, the direction of current passing through the bonding interface, the interconnect size, and the imposed contact resistivity, which in turn affects the measurement of contact resistance. This result suggests a direction for more accurate measurement of contact resistance.
AB - This paper evaluates the current distribution characteristics in the CBKR(Cross-Bridge-Kelvin-Resistor) structure and SGC (Stacked-Greek-Cross) structure designed to extract contact resistance occurring at the Cu-Cu bonding interfaces. We investigated a method to accurately extract contact resistance using Electromagnetic (EM) simulation. The current distribution varies depending on the thickness of the copper, the direction of current passing through the bonding interface, the interconnect size, and the imposed contact resistivity, which in turn affects the measurement of contact resistance. This result suggests a direction for more accurate measurement of contact resistance.
UR - http://www.scopus.com/inward/record.url?scp=85216932489&partnerID=8YFLogxK
U2 - 10.1109/IMPACT63555.2024.10818965
DO - 10.1109/IMPACT63555.2024.10818965
M3 - Conference contribution
AN - SCOPUS:85216932489
T3 - Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
SP - 366
EP - 369
BT - Proceedings - 19th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2024
PB - IEEE Computer Society
T2 - 19th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2024
Y2 - 22 October 2024 through 25 October 2024
ER -