Integration of low profile neural probe array with flexible polyimide cable

Kwan Ling Tan; Ming Yuan Cheng; Poh Giao Teh; Woo Tae Park; Minkyu Je

doi:10.1109/EPTC.2011.6184534

Integration of low profile neural probe array with flexible polyimide cable

Kwan Ling Tan, Ming Yuan Cheng, Poh Giao Teh, Woo Tae Park, Minkyu Je

Dept. of Mechanical & Automotive Engineering

Agency for Science, Technology and Research, Singapore

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

3 Scopus citations

Abstract

In this work, an integration method of low profile probe array system is proposed for minimizing the tissue trauma after implantation. The planar neural probes was assembled with a Si platform to form a 3D probe array, which is then connected to the application-specific integrated circuit (ASIC) chip with a flexible polyimide cable by flip-chip bonding to complete the whole integration. The probe array and flexible polyimide cable have undergone electrical tests to prove to be highly stable and reliable. With the specially designed components, flexible assembly is achieved. The proposed integration method achieved a low profile of the probe array and the requirements for its applications. The impedance of the assembled probe electrode in artificial cerebrospinal fluid (aCSF) is measured to be about 1.1 MΩ at 1kHz.

Original language	English
Title of host publication	2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011
Pages	785-788
Number of pages	4
DOIs	https://doi.org/10.1109/EPTC.2011.6184534
State	Published - 2011
Event	2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011 - Singapore, Singapore Duration: 7 Dec 2011 → 9 Dec 2011

Publication series

Name	2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011

Conference

Conference	2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011
Country/Territory	Singapore
City	Singapore
Period	7/12/11 → 9/12/11

Access to Document

10.1109/EPTC.2011.6184534

Cite this

@inproceedings{0ff43f56f6764d79af4d4494d6ca5bd4,

title = "Integration of low profile neural probe array with flexible polyimide cable",

abstract = "In this work, an integration method of low profile probe array system is proposed for minimizing the tissue trauma after implantation. The planar neural probes was assembled with a Si platform to form a 3D probe array, which is then connected to the application-specific integrated circuit (ASIC) chip with a flexible polyimide cable by flip-chip bonding to complete the whole integration. The probe array and flexible polyimide cable have undergone electrical tests to prove to be highly stable and reliable. With the specially designed components, flexible assembly is achieved. The proposed integration method achieved a low profile of the probe array and the requirements for its applications. The impedance of the assembled probe electrode in artificial cerebrospinal fluid (aCSF) is measured to be about 1.1 MΩ at 1kHz.",

author = "Tan, \{Kwan Ling\} and Cheng, \{Ming Yuan\} and Teh, \{Poh Giao\} and Park, \{Woo Tae\} and Minkyu Je",

year = "2011",

doi = "10.1109/EPTC.2011.6184534",

language = "English",

isbn = "9781457719837",

series = "2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011",

pages = "785--788",

booktitle = "2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011",

note = "2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011 ; Conference date: 07-12-2011 Through 09-12-2011",

}

Tan, KL, Cheng, MY, Teh, PG, Park, WT & Je, M 2011, Integration of low profile neural probe array with flexible polyimide cable. in 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011., 6184534, 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011, pp. 785-788, 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011, Singapore, Singapore, 7/12/11. https://doi.org/10.1109/EPTC.2011.6184534

Integration of low profile neural probe array with flexible polyimide cable. / Tan, Kwan Ling; Cheng, Ming Yuan; Teh, Poh Giao et al.
2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011. 2011. p. 785-788 6184534 (2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Integration of low profile neural probe array with flexible polyimide cable

AU - Tan, Kwan Ling

AU - Cheng, Ming Yuan

AU - Teh, Poh Giao

AU - Park, Woo Tae

AU - Je, Minkyu

PY - 2011

Y1 - 2011

N2 - In this work, an integration method of low profile probe array system is proposed for minimizing the tissue trauma after implantation. The planar neural probes was assembled with a Si platform to form a 3D probe array, which is then connected to the application-specific integrated circuit (ASIC) chip with a flexible polyimide cable by flip-chip bonding to complete the whole integration. The probe array and flexible polyimide cable have undergone electrical tests to prove to be highly stable and reliable. With the specially designed components, flexible assembly is achieved. The proposed integration method achieved a low profile of the probe array and the requirements for its applications. The impedance of the assembled probe electrode in artificial cerebrospinal fluid (aCSF) is measured to be about 1.1 MΩ at 1kHz.

AB - In this work, an integration method of low profile probe array system is proposed for minimizing the tissue trauma after implantation. The planar neural probes was assembled with a Si platform to form a 3D probe array, which is then connected to the application-specific integrated circuit (ASIC) chip with a flexible polyimide cable by flip-chip bonding to complete the whole integration. The probe array and flexible polyimide cable have undergone electrical tests to prove to be highly stable and reliable. With the specially designed components, flexible assembly is achieved. The proposed integration method achieved a low profile of the probe array and the requirements for its applications. The impedance of the assembled probe electrode in artificial cerebrospinal fluid (aCSF) is measured to be about 1.1 MΩ at 1kHz.

UR - https://www.scopus.com/pages/publications/84860894174

U2 - 10.1109/EPTC.2011.6184534

DO - 10.1109/EPTC.2011.6184534

M3 - Conference contribution

AN - SCOPUS:84860894174

SN - 9781457719837

T3 - 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011

SP - 785

EP - 788

BT - 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011

T2 - 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011

Y2 - 7 December 2011 through 9 December 2011

ER -

Integration of low profile neural probe array with flexible polyimide cable

Abstract

Publication series

Conference

Access to Document

Other files and links

Fingerprint

Cite this