TY - JOUR
T1 - Investigation of flow mechanisms in semiconductor wafer fabrication
AU - Kim, S.
AU - Davis, K. R.
AU - Cox, J. F.
PY - 2003/3/10
Y1 - 2003/3/10
N2 - The semiconductor wafer fabrication manufacturing environment is one of the most difficult in which to plan and control. Long and re-entrant routings and high yield loss on new products are two characteristics that impact system performance. This research provides an exploratory investigation of two simplified flow control mechanisms to determine if they might offer promise for further research in this complex environment. Most scheduling and control systems are data intensive and require real-time feedback. Our research explores the use of simple, limited data, flow control mechanisms. The results indicate that these newer planning and control mechanisms, which offer a systems perspective, perform well when compared with a real time, data-intensive, flow control mechanism.
AB - The semiconductor wafer fabrication manufacturing environment is one of the most difficult in which to plan and control. Long and re-entrant routings and high yield loss on new products are two characteristics that impact system performance. This research provides an exploratory investigation of two simplified flow control mechanisms to determine if they might offer promise for further research in this complex environment. Most scheduling and control systems are data intensive and require real-time feedback. Our research explores the use of simple, limited data, flow control mechanisms. The results indicate that these newer planning and control mechanisms, which offer a systems perspective, perform well when compared with a real time, data-intensive, flow control mechanism.
UR - http://www.scopus.com/inward/record.url?scp=0242333121&partnerID=8YFLogxK
U2 - 10.1080/0020754031000065476
DO - 10.1080/0020754031000065476
M3 - Article
AN - SCOPUS:0242333121
SN - 0020-7543
VL - 41
SP - 681
EP - 698
JO - International Journal of Production Research
JF - International Journal of Production Research
IS - 4
ER -