@inproceedings{9105b510138b42ec8995e4593ad7970c,
title = "IR laser flip-chip bonding",
abstract = "A flip-chip bonding process using an IR laser was developed. A focused laser beam can be irradiated on solder balls directly through a silicon wafer using a laser beam of 1064 nm. The focused diameter of a laser beam is around 200 03BC;m which is compatible with the solder ball pitch. A laser scanning system was used for scanning multi-solder-balls with a pre-programmed path. The laser flip-chip bonding process shows its strength on fast bonding, minimized thermal effects on the substrates, and superior bonding quality. A few second bonding time can be achieved for the IR flip-chip bonding process. Moreover, bonding for fine-pitch solder-balls can be achieved with a precision control of laser photonic energy. A DPSS Nd:Yag laser is used as a IR laser source and a power density is around 28 kW/cm2. Bonded flip-chips are presented and its characteristics are discussed.",
keywords = "Bonding, Flip-chip, IR laser, Packaging",
author = "Joohan Kim and Song, \{Chun Sam\} and Ji, \{Hyun Sik\} and Kim, \{Jong Hyeong\}",
year = "2007",
doi = "10.1109/ICCAS.2007.4406844",
language = "English",
isbn = "8995003871",
series = "ICCAS 2007 - International Conference on Control, Automation and Systems",
pages = "2795--2798",
booktitle = "ICCAS 2007 - International Conference on Control, Automation and Systems",
note = "International Conference on Control, Automation and Systems, ICCAS 2007 ; Conference date: 17-10-2007 Through 20-10-2007",
}