Abstract
A charge-trap-type Flash memory with a La2O3-doped Si3N4 charge-trapping layer is demonstrated for the first time. An ultrathin La2O3 layer is inserted in the middle of a Si3N4 layer, followed by high-temperature annealing to mix the two layers. The La2O3-doped Si 3N4 layer, irrespective of Si3N4 deposition processes, is found to provide deep charge-trapping sites, resulting in an excellent pre-/postcycling retention property and high reliability. The optimization of the La2O3 layer thickness and position in the Si3N4 trapping layer has been also systematically studied.
| Original language | English |
|---|---|
| Article number | 5983430 |
| Pages (from-to) | 3314-3320 |
| Number of pages | 7 |
| Journal | IEEE Transactions on Electron Devices |
| Volume | 58 |
| Issue number | 10 |
| DOIs | |
| State | Published - Oct 2011 |
Keywords
- Charge-trap Flash memory
- TaN/AlN/SiO/Si (TANOS)
- lanthanum oxide
- nitride
- retention
- trapping energy level