Lifetime prediction of IGBT modules based on linear damage accumulation

Ui Min Choi; Frede Blaabjerg; Ke Ma

doi:10.1109/APEC.2017.7931017

Lifetime prediction of IGBT modules based on linear damage accumulation

Ui Min Choi, Frede Blaabjerg, Ke Ma

Media IT Engineering Program

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

7 Scopus citations

Abstract

In this paper, the lifetime prediction of power device modules based on the linear damage accumulation in conjunction with real mission profile assessment is studied. Four tests are performed under two superimposed power cycling conditions using an advanced power cycling test setup with 600 V, 30 A, 3-phase molded IGBT modules. The superimposed power cycling conditions are made based on a new lifetime model in respect to junction temperature swing duration, which has been developed based on 39 power cycling test results. The experimental results validate the lifetime prediction of the IGBT modules based on the linear damage accumulation by comparing it with the predicted lifetime from the lifetime model.

Original language	English
Title of host publication	2017 IEEE Applied Power Electronics Conference and Exposition, APEC 2017
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	2276-2281
Number of pages	6
ISBN (Electronic)	9781509053667
DOIs	https://doi.org/10.1109/APEC.2017.7931017
State	Published - 17 May 2017
Event	32nd Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2017 - Tampa, United States Duration: 26 Mar 2017 → 30 Mar 2017

Publication series

Name	Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC

Conference

Conference	32nd Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2017
Country/Territory	United States
City	Tampa
Period	26/03/17 → 30/03/17

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10.1109/APEC.2017.7931017

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Choi, U. M., Blaabjerg, F., & Ma, K. (2017). Lifetime prediction of IGBT modules based on linear damage accumulation. In 2017 IEEE Applied Power Electronics Conference and Exposition, APEC 2017 (pp. 2276-2281). Article 7931017 (Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/APEC.2017.7931017

@inproceedings{b64d8c8e47c24479ae8a6dcbf5df6589,

title = "Lifetime prediction of IGBT modules based on linear damage accumulation",

abstract = "In this paper, the lifetime prediction of power device modules based on the linear damage accumulation in conjunction with real mission profile assessment is studied. Four tests are performed under two superimposed power cycling conditions using an advanced power cycling test setup with 600 V, 30 A, 3-phase molded IGBT modules. The superimposed power cycling conditions are made based on a new lifetime model in respect to junction temperature swing duration, which has been developed based on 39 power cycling test results. The experimental results validate the lifetime prediction of the IGBT modules based on the linear damage accumulation by comparing it with the predicted lifetime from the lifetime model.",

author = "Choi, \{Ui Min\} and Frede Blaabjerg and Ke Ma",

note = "Publisher Copyright: {\textcopyright} 2017 IEEE.; 32nd Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2017 ; Conference date: 26-03-2017 Through 30-03-2017",

year = "2017",

month = may,

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doi = "10.1109/APEC.2017.7931017",

language = "English",

series = "Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

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}

Choi, UM, Blaabjerg, F & Ma, K 2017, Lifetime prediction of IGBT modules based on linear damage accumulation. in 2017 IEEE Applied Power Electronics Conference and Exposition, APEC 2017., 7931017, Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC, Institute of Electrical and Electronics Engineers Inc., pp. 2276-2281, 32nd Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2017, Tampa, United States, 26/03/17. https://doi.org/10.1109/APEC.2017.7931017

Lifetime prediction of IGBT modules based on linear damage accumulation. / Choi, Ui Min; Blaabjerg, Frede; Ma, Ke.
2017 IEEE Applied Power Electronics Conference and Exposition, APEC 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. 2276-2281 7931017 (Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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PY - 2017/5/17

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N2 - In this paper, the lifetime prediction of power device modules based on the linear damage accumulation in conjunction with real mission profile assessment is studied. Four tests are performed under two superimposed power cycling conditions using an advanced power cycling test setup with 600 V, 30 A, 3-phase molded IGBT modules. The superimposed power cycling conditions are made based on a new lifetime model in respect to junction temperature swing duration, which has been developed based on 39 power cycling test results. The experimental results validate the lifetime prediction of the IGBT modules based on the linear damage accumulation by comparing it with the predicted lifetime from the lifetime model.

AB - In this paper, the lifetime prediction of power device modules based on the linear damage accumulation in conjunction with real mission profile assessment is studied. Four tests are performed under two superimposed power cycling conditions using an advanced power cycling test setup with 600 V, 30 A, 3-phase molded IGBT modules. The superimposed power cycling conditions are made based on a new lifetime model in respect to junction temperature swing duration, which has been developed based on 39 power cycling test results. The experimental results validate the lifetime prediction of the IGBT modules based on the linear damage accumulation by comparing it with the predicted lifetime from the lifetime model.

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PB - Institute of Electrical and Electronics Engineers Inc.

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Choi UM, Blaabjerg F, Ma K. Lifetime prediction of IGBT modules based on linear damage accumulation. In 2017 IEEE Applied Power Electronics Conference and Exposition, APEC 2017. Institute of Electrical and Electronics Engineers Inc. 2017. p. 2276-2281. 7931017. (Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC). doi: 10.1109/APEC.2017.7931017

Lifetime prediction of IGBT modules based on linear damage accumulation

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