Low-Temperature Sintering Characteristics of Ag-Based Complex Inks Using Transient Melting and Joining of Sn–58Bi Nanoparticles

Woo Lim Choi, Jong Hyun Lee

Research output: Contribution to journalArticlepeer-review

2 Scopus citations

Abstract

Abstract: A novel complex ink was fabricated by mixing Sn–58Bi nanoparticles with a commercial conductive ink containing Ag nanoparticles and then sintered rapidly for 110 s at 140 °C in air using a conveyor-type reflow furnace. Sn–58Bi nanoparticles smaller than 15 nm wetted on the neighboring Ag nanoparticles immediately after melting at temperatures lower than their melting point, and hence, acted as transient liquid-phase binders. The composite film sintered with 4 wt% Sn–58Bi exhibited stability and a low electrical resistivity of 4.46 μΩ cm, and hence, was found to be compatible with low-cost flexible films. Graphical Abstract: [Figure not available: see fulltext.].

Original languageEnglish
Pages (from-to)1388-1393
Number of pages6
JournalMetals and Materials International
Volume25
Issue number5
DOIs
StatePublished - 6 Sep 2019

Keywords

  • Complex ink
  • Electrical resistivity
  • Nanostructure
  • Sintering
  • Thin films

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