Microstructure and drop/shock reliability of Sn-Ag-Cu-In solder joints

A. Mi Yu; Jae Won Jang; Jong Hyun Lee; Jun Ki Kim; Mok Soon Kim

doi:10.1504/IJMSI.2014.064772

Microstructure and drop/shock reliability of Sn-Ag-Cu-In solder joints

A. Mi Yu, Jae Won Jang, Jong Hyun Lee, Jun Ki Kim, Mok Soon Kim

Dept. of Materials Science & Engineering

Research output: Contribution to journal › Article › peer-review

1 Scopus citations

Abstract

The drop/shock reliability of new quaternary Sn-Ag-Cu-In Pb-free solder alloy with increasing amounts of copper was investigated on the basis of their mechanical properties and microstructures in comparison with ternary Sn-1.2Ag-0.5Cu Pb-free solder alloy and quaternary Sn-1.2Ag-0.5Cu-0.4In Pb-free solder alloy as suggested in a previous work. The results showed that Sn-1.2Ag-0.7Cu-0.4In solder alloy has excellent drop/shock reliability compared to Sn-1.2Ag-0.5Cu and Sn-1.2Ag-0.5Cu-0.4In solder alloys owing to the thin IMC thickness and the increased mechanical strength. It was considered that indium addition restrained the IMC growth and increasing the amount of copper promoted the formation of Cu₆Sn₅and Ag₃Sn phase, which resulted in an increase in the alloy strength.

Original language	English
Pages (from-to)	42-52
Number of pages	11
Journal	International Journal of Materials and Structural Integrity
Volume	8
Issue number	1-3
DOIs	https://doi.org/10.1504/IJMSI.2014.064772
State	Published - 1 Sep 2014

Keywords

Drop/shock reliability
Pb-free solder.
Sn-Ag-Cu-In alloy

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10.1504/IJMSI.2014.064772

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@article{128ad845dff640e2be71b0a0fb73d90f,

title = "Microstructure and drop/shock reliability of Sn-Ag-Cu-In solder joints",

abstract = "The drop/shock reliability of new quaternary Sn-Ag-Cu-In Pb-free solder alloy with increasing amounts of copper was investigated on the basis of their mechanical properties and microstructures in comparison with ternary Sn-1.2Ag-0.5Cu Pb-free solder alloy and quaternary Sn-1.2Ag-0.5Cu-0.4In Pb-free solder alloy as suggested in a previous work. The results showed that Sn-1.2Ag-0.7Cu-0.4In solder alloy has excellent drop/shock reliability compared to Sn-1.2Ag-0.5Cu and Sn-1.2Ag-0.5Cu-0.4In solder alloys owing to the thin IMC thickness and the increased mechanical strength. It was considered that indium addition restrained the IMC growth and increasing the amount of copper promoted the formation of Cu6Sn5and Ag3Sn phase, which resulted in an increase in the alloy strength.",

keywords = "Drop/shock reliability, Pb-free solder., Sn-Ag-Cu-In alloy",

author = "Yu, {A. Mi} and Jang, {Jae Won} and Lee, {Jong Hyun} and Kim, {Jun Ki} and Kim, {Mok Soon}",

note = "Publisher Copyright: {\textcopyright} 2014 Inderscience Enterprises Ltd.",

year = "2014",

month = sep,

day = "1",

doi = "10.1504/IJMSI.2014.064772",

language = "English",

volume = "8",

pages = "42--52",

journal = "International Journal of Materials and Structural Integrity",

issn = "1745-0055",

number = "1-3",

}

TY - JOUR

T1 - Microstructure and drop/shock reliability of Sn-Ag-Cu-In solder joints

AU - Yu, A. Mi

AU - Jang, Jae Won

AU - Lee, Jong Hyun

AU - Kim, Jun Ki

AU - Kim, Mok Soon

PY - 2014/9/1

Y1 - 2014/9/1

N2 - The drop/shock reliability of new quaternary Sn-Ag-Cu-In Pb-free solder alloy with increasing amounts of copper was investigated on the basis of their mechanical properties and microstructures in comparison with ternary Sn-1.2Ag-0.5Cu Pb-free solder alloy and quaternary Sn-1.2Ag-0.5Cu-0.4In Pb-free solder alloy as suggested in a previous work. The results showed that Sn-1.2Ag-0.7Cu-0.4In solder alloy has excellent drop/shock reliability compared to Sn-1.2Ag-0.5Cu and Sn-1.2Ag-0.5Cu-0.4In solder alloys owing to the thin IMC thickness and the increased mechanical strength. It was considered that indium addition restrained the IMC growth and increasing the amount of copper promoted the formation of Cu6Sn5and Ag3Sn phase, which resulted in an increase in the alloy strength.

AB - The drop/shock reliability of new quaternary Sn-Ag-Cu-In Pb-free solder alloy with increasing amounts of copper was investigated on the basis of their mechanical properties and microstructures in comparison with ternary Sn-1.2Ag-0.5Cu Pb-free solder alloy and quaternary Sn-1.2Ag-0.5Cu-0.4In Pb-free solder alloy as suggested in a previous work. The results showed that Sn-1.2Ag-0.7Cu-0.4In solder alloy has excellent drop/shock reliability compared to Sn-1.2Ag-0.5Cu and Sn-1.2Ag-0.5Cu-0.4In solder alloys owing to the thin IMC thickness and the increased mechanical strength. It was considered that indium addition restrained the IMC growth and increasing the amount of copper promoted the formation of Cu6Sn5and Ag3Sn phase, which resulted in an increase in the alloy strength.

KW - Drop/shock reliability

KW - Pb-free solder.

KW - Sn-Ag-Cu-In alloy

UR - http://www.scopus.com/inward/record.url?scp=84907271393&partnerID=8YFLogxK

U2 - 10.1504/IJMSI.2014.064772

DO - 10.1504/IJMSI.2014.064772

M3 - Article

AN - SCOPUS:84907271393

SN - 1745-0055

VL - 8

SP - 42

EP - 52

JO - International Journal of Materials and Structural Integrity

JF - International Journal of Materials and Structural Integrity

IS - 1-3

ER -

Microstructure and drop/shock reliability of Sn-Ag-Cu-In solder joints

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Keywords

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