Nitrogen-annealed copper complex synthesized using CuO for application to conductive Cu films

A Cu(II) formate complex was synthesized by reacting low-cost Cu(II) oxide (CuO) with formic acid. The formate was mixed with-terpineol to prepare a paste, which was stencil printed onto glass slides and thermally annealed under nitrogen at 400 C to fabricate conductive Cu films. The Cu(II) formate decomposed and was transformed into pure Cu particles, which were sintered during annealing. A porous Cu film was obtained because of necking between the Cu particles, and the Cu film annealed for 2 h exhibited an excellent electrical resistivity of 2.13×105cm.