TY - GEN
T1 - Novel circular microchannels fabrication method for artery thrombosis investigation
AU - Nguyen, Thanh Qua
AU - Lee, Sang Youp
AU - Park, Woo Tae
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/4/24
Y1 - 2018/4/24
N2 - This paper demonstrates the straightforward fabrication process of polydimethylsiloxane (PDMS) circular cross-section microfluidic channels by using air pressure to define the deformation of partially cured PDMS surface. Based on this technique, circular cross-section microchannel can be easily produced in a wide range of dimensions from 100 μm to 500 μm with simple bench top equipment. Using self-alignment and bonding with partially cured PDMS, this technique can eliminate air plasma activated bonding and tedious alignment processes. We successfully used the technique to fabricate multiple dimensions of circular microchannels to mimic the artery for investigating artery thrombosis phenomenon on a chip.
AB - This paper demonstrates the straightforward fabrication process of polydimethylsiloxane (PDMS) circular cross-section microfluidic channels by using air pressure to define the deformation of partially cured PDMS surface. Based on this technique, circular cross-section microchannel can be easily produced in a wide range of dimensions from 100 μm to 500 μm with simple bench top equipment. Using self-alignment and bonding with partially cured PDMS, this technique can eliminate air plasma activated bonding and tedious alignment processes. We successfully used the technique to fabricate multiple dimensions of circular microchannels to mimic the artery for investigating artery thrombosis phenomenon on a chip.
UR - https://www.scopus.com/pages/publications/85046997793
U2 - 10.1109/MEMSYS.2018.8346559
DO - 10.1109/MEMSYS.2018.8346559
M3 - Conference contribution
AN - SCOPUS:85046997793
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 352
EP - 354
BT - 2018 IEEE Micro Electro Mechanical Systems, MEMS 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 31st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2018
Y2 - 21 January 2018 through 25 January 2018
ER -