Observation on Ni-enhanced W grain growth in W-wire bundle model

  • In Hyung Moon
  • , Ki Youl Kim
  • , Sung Tag Oh
  • , Jeong Keun Lee
  • , Myung Jin Suk
  • , Young Do Kim

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

The effect of Ni additive on the recrystallization and grain growth in W-wires has been investigated in order to explain the role of nickel in the activated sintering of W, because both phenomena are comparable to each other, being principally diffusion-controlled and greatly influenced by the presence of Ni. The experiment was carried out in W-wires bundle model, in which the initial state of nickel could be appropriately controlled by arranging the Ni-coated W-wire together with non-coated ones. The recrystallization and grain growth processes were observed and analyzed on the basis of geometrical relation between Ni-source and relevant W-wires. The development of recrystallization front depends on the Ni- diffusion path and rate. Nickel diffuses fast into W-wires through high diffusivity paths such as surface and grain boundary, inducing recrystallization at relatively low temperature. The apparent diffusivity of Ni in W-wire estimated by measuring the migration rate of recrystallization front is about 10-9 cm/s, having two orders higher than the data found in literature. The role of nickel in W is further discussed.

Original languageEnglish
Title of host publicationProperties of Emerging P/M Materials
PublisherPubl by Metal Powder Industries Federation
Pages159-170
Number of pages12
ISBN (Print)187895427X
StatePublished - 1992
EventProceedings of the 1992 Powder Metallurgy World Congress. Part 1 (of 9) - San Francisco, CA, USA
Duration: 21 Jun 199226 Jun 1992

Publication series

NameAdvances in Powder Metallurgy
Volume8
ISSN (Print)1042-8860

Conference

ConferenceProceedings of the 1992 Powder Metallurgy World Congress. Part 1 (of 9)
CitySan Francisco, CA, USA
Period21/06/9226/06/92

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