@inproceedings{1086c30354004018b987fee116f78dc5,
title = "On-chip ovenization of encapsulated Disk Resonator Gyroscope (drg)",
abstract = "This paper reports, for the first time, a single-chip ovenization of a fully-encapsulated MEMS gyroscope to improve the stability of the scale factor and bias. We use the frequency output of the gyroscope as a thermometer, and, in turn heat the device through an on-chip silicon heater defined in the encapsulation layer. During temperature-controlled operation, the scale factor holds constant and the bias remains less than 1°/s, even as external temperature changed from 0-80°C.",
keywords = "bias drift, Disk resonator gyroscope (DRG), epi-seal, scale factor drift, temperature compensation, μ-Oven",
author = "Ahn, \{C. H.\} and Hong, \{V. A.\} and W. Park and Y. Yang and Y. Chen and Ng, \{E. J.\} and J. Huynh and Challoner, \{A. D.\} and Goodson, \{K. E.\} and Kenny, \{T. W.\}",
note = "Publisher Copyright: {\textcopyright} 2015 IEEE.; 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015 ; Conference date: 21-06-2015 Through 25-06-2015",
year = "2015",
month = aug,
day = "5",
doi = "10.1109/TRANSDUCERS.2015.7180855",
language = "English",
series = "2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "39--42",
booktitle = "2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015",
}